PBSS8110Y: 100 V、1 A NPN低VCEsat (BISS)晶体管
NPN低VCEsat晶体管，采用SOT363 (SC-88)塑料封装。
PBSS8110Y: 产品结构框图
PBSS8110Y: 应用结构框图
SOT363
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 100 V, 1 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (177.0 kB) PBSS8110Y [English] | 11 Dec 2009 |
应用说明 (2)
| 名称/描述 | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English] | 12 Jul 2011 |
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 [English] | 06 Jan 2006 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English] | 15 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PBSS8110Y NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS8110Y_1 [English] | 31 Jan 2015 |
| PBSS8110Y NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS8110Y_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
SPICE
- PBSS8110Y SPICE model (REV 1.4) prm PBSS8110Y_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Transistor polarity | transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS8110Y | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | NPN | 1 | 290 | 100 | 1 | 3 | 150 | 100 | 160 | 200 | 200 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS8110Y | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PBSS8110Y,115 (9340 579 82115) | 81% | PBSS8110Y |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- PBSS8110Y NXP® Product Reliability PBSS8110Y
- PBSS8110Y NXP Product Quality PBSS8110Y
- MAR_SOT363 Topmark BSS84AKS
- PBSS8110Y SPICE model PBSS8110Y
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- PBSS8110Y
- PBSS8110Y
- BFU520Y
