PDTC114EMB:NPN配电阻晶体管;R1 = 10 kΩ,R2 = 10 kΩ

NPN配电阻晶体管(RET),采用无引脚超小型DFN1006B-3 (SOT883B)表面贴装器件(SMD)塑料封装。PNP补充产品:PDTA114EMB。

特性和优势
    • 100 mA的输出电流能力
    • 元器件数量更少
    • 内置偏置电阻
    • 贴片成本更低
    • 电路设计更为简化
    • 符合AEC-Q101标准
    • 无引脚超小型SMD塑料封装
    • 0.37mm的低封装高度
应用
    • 低电流外设驱动器
    • 控制IC输入
    • 可在数字应用中替代通用晶体管
    • 移动应用
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
VCEOcollector-emitter voltageopen base50V
IOoutput current100mA
R1resistance 1Tamb = 25 °C71013
R2/R1resistance ratioTamb = 25 °C0.811.2 
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
PDTC114EMB
DFN1006B-3
(SOT883B)
sot883b_poReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mm量产0100 1010PDTC114EMB,315( 9340 670 08315 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1Iinput (base)
2GGND (emitter)
3Ooutput (collector)
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期EFRIFR (FIT)MTBF(小时)潮湿敏感度等级MSL LF
PDTC114EMBPDTC114EMB,315Always Pb-free143.00.661.52E911
文档资料
档案名称标题类型格式日期
PDTC114EMB (中文)NPN resistor-equipped transistor; R1 = 10 kΩ, R2 = 10 kΩData sheetpdf2012-07-03
PDTC114EMB_NXP_Product_QualityPDTC114EMB NXP Product QualityQuality documentpdf2015-01-31
PDTC114EMB_NXP_Product_ReliabilityPDTC114EMB NXP Product ReliabilityQuality documentpdf2015-01-31
PDTC114EMBPDTC114EMB SPICE modelSPICE modelprm2012-07-22
Reflow_Soldering_ProfileReflow Soldering ProfileReflow solderingpdf2013-09-30
sot883b_poLeadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mmOutline drawingpdf2011-08-23
订购信息
型号订购码 (12NC)可订购的器件编号
PDTC114EMB9340 670 08315PDTC114EMB,315
模型
标题类型日期
PDTC114EMB SPICE modelSPICE model2012-07-22
NPN resistor-equipped transistor; R1 = 10 kΩ, R2 = 10 kΩ PDTC114EMB
PDTC114EMB NXP Product Quality PDTC114EMB
PDTC114EMB NXP Product Reliability PDTC114EMB
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm PMZB950UPE
PDTC114EMB SPICE model PDTC114EMB