数据手册DataSheet 下载：PMGD370XN 双N沟道TrechMOS极低电平FET.pdf

双极低电平N沟道增强型场效应晶体管(FET)，采用使用TrenchMOS技术的塑料封装。该产品仅设计适合用于计算、通信、消费电子和工业应用。

产品特点
  • 低导通电阻，因而导通损耗很小
  • 占用面积小，节省PCB空间（比SOT23小40 %）
  • 快速开关特性，适用于高频应用
  • 适用于低栅极驱动源
产品应用
  • 驱动电路
  • 便携式设备中的开关
订购型号
订购型号封装Outline versionReflow-/Wave soldering包装产品状态标示订购器件的编号
PMGD370XNTSSOP6 (SOT363)sot363_poReflow_Soldering_Profile
Wave_Soldering_Profile		Tape reel smd激活D3%PMGD370XN,115( 9340 577 28115 )
品质、可靠性及RoHS化学成分
订购型号订购器件的编号RoHS / RHF无铅开始日期EFRIFR (FIT)MTBF（小时）潮湿敏感度等级MSL LF
PMGD370XNPMGD370XN,115week 35, 2003220.01.029.79E811
产品技术资料
文档标题类型分类格式更新日期
PMGD370XN (中文)：Dual N-channel uTrenchmos (tm) extremely low level FETData sheetpdf2004-02-27
AN10273：Power MOSFET single-shot and repetitive avalanche ruggedness ratingApplication notepdf2010-03-17
AN11158：Understanding power MOSFET data sheet parametersApplication notepdf2014-02-04
AN11243：Failure signature of Electrical Overstress on Power MOSFETsApplication notepdf2012-10-29
AN11158_ZH：Understanding power MOSFET data sheet parametersApplication notepdf2013-11-08
75017288：Broad small-signal MOSFET portfolio to suit a wide range of applicationsLine cardpdf2012-08-23
PMGD370XN_NXP_Product_Quality：PMGD370XN NXP Product QualityQuality documentpdf2014-04-22
PMGD370XN_10_08_2011：PMGD370XN_10_08_2011 Spice parameterSPICE modellib2011-08-22
SOT363_115：TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115Packingpdf2012-11-15
SOT363_135：TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135Packingpdf2012-11-20
SOT363_165：TSSOP6; reel pack; reversed product orientation; 12NC ending 165Packingpdf2012-11-20
SOT363_125：Tape reel SMD; reversed product orientation 12NC ending 125Packingpdf2012-11-20
MAR_SOT363：MAR_SOT363 TopmarkTop Markingpdf2013-06-03
Reflow_Soldering_Profile：Reflow Soldering ProfileReflow solderingpdf2013-09-30
Wave_Soldering_Profile：Wave Soldering ProfileWave solderingpdf2013-09-30
sot363_fw：Footprint for wave soldering SOT363Wave solderingpdf2009-10-08
sot363_po：plastic surface-mounted package; 6 leadsOutline drawingpdf2009-10-08
sot363_fr：Footprint for reflow soldering SOT363Reflow solderingpdf2010-07-13
Dual N-channel uTrenchmos (tm) extremely low level FET PMGD370XN
Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7M12-60E
Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7K6R8-40E
Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
PMGD370XN NXP Product Quality PMGD370XN
PMGD370XN_10_08_2011 Spice parameter PMGD370XN
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 pesd5v0l5uy
TSSOP6; reel pack; reversed product orientation; 12NC ending 165 1PS88SB82
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
MAR_SOT363 Topmark BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Footprint for wave soldering SOT363 BFU520Y
plastic surface-mounted package; 6 leads BFU520Y
Footprint for reflow soldering SOT363 BFU520Y
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