PMV37EN2: 30 V，N沟道Trench MOSFET _ BDTIC 中国领先电子元器件代理商

PMV37EN2: 30 V，N沟道Trench MOSFET

N沟道增强模式场效应晶体管(FET)，采用小型SOT23 (TO-236AB)表面贴装器件(SMD)塑料封装，使用Trench MOSFET技术。

SOT023

数据手册 (1)

名称/描述	Modified Date
30 V, N-channel Trench MOSFET (REV 2.0) PDF (493.0 kB) PMV37EN2 [English]	03 Jun 2014

应用说明 (6)

名称/描述	Modified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English]	13 Jul 2016
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English]	22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English]	19 May 2014
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English]	14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English]	16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English]	27 Jan 2011

选型工具指南 (2)

名称/描述	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]	17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English]	11 Sep 2014

封装信息 (1)

名称/描述	Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]	08 Feb 2016

包装 (1)

名称/描述	Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]	16 Nov 2012

可靠性与质量信息 (2)

名称/描述	Modified Date
PMV37EN2 NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMV37EN2_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
PMV37EN2 NXP® Product Reliability (REV 1.1) PDF (84.0 kB) PMV37EN2_NXP_PRODUCT_RELIABILITY [English]	31 Jan 2015

支持信息 (3)

名称/描述	Modified Date
Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English]	07 Aug 2015
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

SPICE

PMV37EN2 Spice model (REV 1.0) lib PMV37EN2_26_5_2014 1/27/2015

订购信息

型号	状态	Package name	Package version	Channel type	Number of transistors	V_DS [max] (V)	R_DSon [max] @ V_GS = 10 V (mΩ)	R_DSon [max] @ V_GS = 5 V (mΩ)	R_DSon [max] @ V_GS = 4.5 V (mΩ)	R_DSon [max] @ V_GS = 2.5 V (mΩ)	T_j [max] (°C)	I_D [max] (A)	Q_GD [typ] (nC)	QG(tot) [typ] @ VGS = 4.5 V (nC)	Q_G(tot) [typ] (nC)	QG(tot) [typ] @ VGS = 10 V (nC)	P_tot [max] (W)	Q_r [typ] (nC)	V_GSth [typ] (V)	Automotive qualified	C_iss [typ] (pF)	C_oss [typ] (pF)	日期
PMV37EN2	Active	TO-236AB	SOT23	N	1	30	36		47		150	5.6	0.4		3.6	3.6	0.51	3.6	1.5	N	209	50	2014-05-28

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
PMV37EN2		SOT23	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4	Active	PMV37EN2R (9340 684 92215)	%K7	PMV37EN2		Always Pb-free	1636.0	7.59	1.32E8	1	1

30 V, N-channel Trench MOSFET PMV37EN2

Using power MOSFETs in parallel BUK7M12-60E

LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E

Using RC Thermal Models BUK7M12-60E

LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E

LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E

LFPAK MOSFET thermal design guide BUK7M12-60E

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW

PMV37EN2 NXP® Product Quality PMV37EN2

PMV37EN2 NXP® Product Reliability PMV37EN2

Power MOSFET frequently asked questions and answers BUK7M12-60E

PMV37EN2 Spice model PMV37EN2

plastic surface-mounted package; 3 leads BSS84AK

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK

PMBFJ309

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