PMXB75UPE: 20 V，P沟道Trench MOSFET _ BDTIC 中国领先电子元器件代理商

PMXB75UPE: 20 V，P沟道Trench MOSFET

P沟道增强模式场效应晶体管(FET)，采用无铅超小型DFN1010D-3 (SOT1215)表面贴装器件(SMD)塑料封装，使用Trench MOSFET技术。

sot1215_3d

数据手册 (1)

名称/描述	Modified Date
20 V, P-channel Trench MOSFET (REV 3.0) PDF (254.0 kB) PMXB75UPE [English]	08 Jul 2014

应用说明 (7)

名称/描述	Modified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English]	13 Jul 2016
Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English]	10 Dec 2015
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English]	22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English]	19 May 2014
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English]	14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English]	16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English]	27 Jan 2011

选型工具指南 (2)

名称/描述	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]	17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English]	11 Sep 2014

封装信息 (1)

名称/描述	Modified Date
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English]	08 Feb 2016

可靠性与质量信息 (2)

名称/描述	Modified Date
PMXB75UPE NXP® Product Reliability (REV 1.1) PDF (84.0 kB) PMXB75UPE_1 [English]	31 Jan 2015
PMXB75UPE NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMXB75UPE_NXP_PRODUCT_QUALITY [English]	31 Jan 2015

支持信息 (2)

名称/描述	Modified Date
Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English]	07 Aug 2015
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013

SPICE

PMXB75UPE Spice model (REV 1.0) lib PMXB75UPE_18_11_2013 12/13/2013

订购信息

型号	状态	Package version	Package name	Channel type	Number of transistors	V_DS [max] (V)	R_DSon [max] @ V_GS = 10 V (mΩ)	R_DSon [max] @ V_GS = 5 V (mΩ)	R_DSon [max] @ V_GS = 4.5 V (mΩ)	R_DSon [max] @ V_GS = 2.5 V (mΩ)	T_j [max] (°C)	I_D [max] (A)	Q_GD [typ] (nC)	Q_G(tot) [typ] (nC)	QG(tot) [typ] @ VGS = 4.5 V (nC)	P_tot [max] (W)	QG(tot) [typ] @ VGS = 10 V (nC)	Q_r [typ] (nC)	V_GSth [typ] (V)	Automotive qualified	C_iss [typ] (pF)	C_oss [typ] (pF)	日期
PMXB75UPE	Active	SOT1215	DFN1010D-3	P	1	-20			85	110	150	-2.9	2.1	6.8	6.8	0.317			-0.68	N	608	75	2014-02-04

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
PMXB75UPE		SOT1215	Reflow_Soldering_Profile	Reel 7" Q2/T3	Active	PMXB75UPEZ (9340 671 53147)	00 01 00	PMXB75UPE		Always Pb-free	1145.0	5.31	1.88E8	1	1
PMXB75UPE		SOT1215	Reflow_Soldering_Profile	Reel 7" Q1/T1	Withdrawn	PMXB75UPEX (9340 671 53115)	00 01 00	PMXB75UPE		Always Pb-free	1145.0	5.31	1.88E8	1	1

20 V, P-channel Trench MOSFET PMXB75UPE

Using power MOSFETs in parallel BUK7M12-60E

Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E

LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E

Using RC Thermal Models BUK7M12-60E

LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E

LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E

LFPAK MOSFET thermal design guide BUK7M12-60E

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW

PMXB75UPE NXP® Product Reliability PMXB75UPE

PMXB75UPE NXP® Product Quality PMXB75UPE

Power MOSFET frequently asked questions and answers BUK7M12-60E

PMXB75UPE Spice model PMXB75UPE

DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE

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