PSMN2R5-30YL: N沟道30 V 2.4 mΩ逻辑电平MOSFET，采用LFPAK封装
逻辑电平N沟道增强型场效应晶体管(FET)，采用塑料封装，使用TrenchMOS技术。该产品仅设计适合用于工业和通信应用。
SOT669
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| N-channel 30 V 2.4 mOhm logic level MOSFET in LFPAK (REV 4.0) PDF (391.0 kB) PSMN2R5-30YL [English] | 10 Mar 2011 |
应用说明 (13)
| 名称/描述 | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English] | 10 Dec 2015 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 [English] | 04 Feb 2014 |
| Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH [English] | 08 Nov 2013 |
| Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 [English] | 29 Oct 2012 |
| Using Power MOSFET Zth Curves (REV 1.0) PDF (212.0 kB) AN11156 [English] | 10 Oct 2012 |
| Designing RC Snubbers (REV 1.0) PDF (565.0 kB) AN11160 [English] | 01 Oct 2012 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
| Logic level VGS ratings for NXP® power MOSFETs (REV 1.0) PDF (56.0 kB) AN10721 [English] | 18 Jul 2008 |
手册 (3)
| 名称/描述 | Modified Date |
|---|---|
| Ultra-reliable LFPAK56 and LFPAK33 (REV 1.0) PDF (4.4 MB) 75017659 [English] | 18 May 2015 |
| LFPAK - The Toughest Power SO8 (REV 1.2) PDF (1.0 MB) 939775016838_LR [English] | 17 Mar 2010 |
| 25 V to 100 V MOSFETs in Power-SO8 (REV 1.0) PDF (137.0 kB) 939775016849_LR [English] | 13 Jan 2010 |
选型工具指南 (2)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads (REV 1.0) PDF (213.0 kB) SOT669 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| LFPAK56; Reel pack; SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,115 or... (REV 3.0) PDF (101.0 kB) SOT669_115 [English] | 09 Sep 2016 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English] | 07 Aug 2015 |
SPICE
- PSMN2R5_30YL SPICE model (REV 1.3) prm PSMN2R5_30YL 6/8/2012
- PSMN2R5-30YL SPICE model (REV 1.0) lib PSMN2R5-30YL_1 3/16/2010
Thermal model
- PSMN2R5-30YL Thermal model (REV 1.0) pdml PSMN2R5-30YL_1_2 8/27/2008
订购信息
| 型号 | 状态 | Package version | Package name | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | Ptot [max] (W) | QG(tot) [typ] @ VGS = 10 V (nC) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | 日期 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMN2R5-30YL | Active | SOT669 | LFPAK56; Power-SO8 | N | 1 | 30 | 2.4 | 3.16 | 175 | 100 | 6.5 | 27 | 27 | 88 | 52 | 38 | 1.7 | N | 3468 | 710 | 2011-03-10 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMN2R5-30YL | | SOT669 | Reel 7" Q1/T1 | Active | PSMN2R5-30YL,115 (9340 630 71115) | 2R530 | PSMN2R5-30YL |   | 1 | 1 |
- N-channel 30 V 2.4 mOhm logic level MOSFET in LFPAK PSMN2R5-30YL
- Using power MOSFETs in parallel BUK7M12-60E
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using RC Thermal Models BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7K6R8-40E
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- Using Power MOSFET Zth Curves BUK7M12-60E
- Designing RC Snubbers BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- LFPAK MOSFET thermal design guide BUK7M12-60E
- Logic level VGS ratings for NXP® power MOSFETs PSMN7R0-30YL
- Ultra-reliable LFPAK56 and LFPAK33 BUK7M12-60E
- LFPAK - The Toughest Power SO8 buk9y58-75b
- 25 V to 100 V MOSFETs in Power-SO8 PSMN8R5-60YS
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- PSMN2R5_30YL SPICE model PSMN2R5-30YL
- PSMN2R5-30YL SPICE model PSMN2R5-30YL
- PSMN2R5-30YL Thermal model PSMN2R5-30YL
- Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads PHPT61003PY
- LFPAK56; Reel pack; SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,115 or... PHPT61003PY
- PSMN9R5-30YLC
