PSSI2021SAY: 采用SOT353封装的恒流源

配电阻PNP二极管,其在单个芯片上具有两个二极管,采用SOT353 (SC-88A)塑料封装。通过连接针脚4和针脚5之间的一个外部电阻而稳定在15 uA和50 mA之间的输出电流。

PSSI2021SAY: 产品结构框图
PSSI2021SAY: 应用结构框图
Outline 3d SOT353
数据手册 (1)
名称/描述Modified Date
Constant current source in SOT353 package (REV 3.0) PDF (66.0 kB) PSSI2021SAY [English]11 Sep 2009
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 5 leads (REV 1.0) PDF (245.0 kB) SOT353 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (191.0 kB) SOT353_115 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PSSI2021SAY NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PSSI2021SAY_1 [English]31 Jan 2015
PSSI2021SAY NXP® Product Quality (REV 1.1) PDF (74.0 kB) PSSI2021SAY_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 [English]03 Jun 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)说明
PSSI2021SAYActiveSOT353TSSOP52 x 1.25 x 0.95Constant Current Source
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PSSI2021SAYSOT353Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePSSI2021SAY,115 (9340 565 64115)S1%PSSI2021SAYweek 31, 2003153.00.711.41E911
Constant current source in SOT353 package PSSI2021SAY
PSSI2021SAY NXP® Product Reliability PSSI2021SAY
PSSI2021SAY NXP® Product Quality PSSI2021SAY
MAR_SOT353 Topmark 74LVC1G17_Q100
PSSI2021SAY SPICE model PSSI2021SAY
plastic surface-mounted package; 5 leads NX3L1G66GW-Q100
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4ug
PZUXDB2_SERIES
PSSI2021SAY
NCX2202