SA605: 高性能低功耗混频器FM IF系统
SA605是高性能单片低功耗FM IF系统，集成了一个混频器/振荡器、两个限幅中频放大器、正交检波器、静音、对数接收信号强度指示器(RSSI)以及电压调节器。SA605结合了Signetics的功能？SA602和SA604A，具有更高的混频器输入截点、更高的IF带宽(25MHz)和温度补偿RSSI以及限幅器，可实现更高性能的应用。SA605采用20引脚双列直插式塑料、20引脚SOL（表面贴装微型封装）和20引脚SSOP（紧缩小型封装）。
SA605和SA615在功能上是相同的器件类型。这两个器件之间的差别在于所保证的规范。相比SA605，SA615具有较高的ICC、较低的输入三阶截点、较低的转换混频器增益、较低的限幅器增益、较低的AM抑制、较低的SINAD、较高的THD和较高的RSSI误差。SA605和SA615器件均符合适用于AMPS和TACS蜂窝无线电应用的EIA规范。
有关更多技术信息，请参阅应用笔记AN1994、AN1995和AN1996，其中包括示例应用图表、该产品的完整概述以及可供参考的插图。
SA605: 产品结构框图
SOT163-1
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| High performance low power mixer FM IF system (REV 5.0) PDF (525.0 kB) SA605 [English] | 14 Nov 2014 |
应用说明 (5)
| 名称/描述 | Modified Date |
|---|---|
| Evaluating the SA605 SO and SSOP demo board (REV 2.0) PDF (638.0 kB) AN1995 [English] | 10 Sep 2014 |
| Demodulating at 10.7 MHz IF with the SA605 (REV 2.0) PDF (1.3 MB) AN1996 [English] | 01 Sep 2014 |
| High sensitivity applications of low-power RF/IF integrated circuits (REV 3.0) PDF (1.9 MB) AN1993 [English] | 14 Aug 2014 |
| Reviewing key areas when designing with the SA605 (REV 1.0) PDF (3.3 MB) AN1994_1 [English] | 11 Aug 2014 |
| An FM/IF system for DECT and other high speed GFSK applications (REV 3.0) PDF (1.1 MB) AN1998 [English] | 25 Jul 2014 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| RF/IF building blocks for niche handheld devices (REV 1.0) PDF (3.5 MB) 75017548 [English] | 03 Sep 2014 |
封装信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| plastic small outline package; 20 leads; body width 7.5 mm (REV 1.0) PDF (335.0 kB) SOT163-1 [English] | 08 Feb 2016 |
| plastic shrink small outline package; 20 leads; body width 4.4 mm (REV 1.0) PDF (329.0 kB) SOT266-1 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| SO20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (246.0 kB) SOT163-1_118 [English] | 15 Apr 2013 |
| SSOP20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (222.0 kB) SOT266-1_118 [English] | 15 Apr 2013 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English] | 08 Oct 2009 |
订购信息
| 型号 | 状态 | Package name | RF-IF function | RF frequency [max] (MHz) | IF bandwidth [max] | VCC [min] (V) | VCC [max] (V) | ICC [max] (mA) | Mixer gain [min] (dB) | Mixer Noise Figure [typ] (dB) | 12 dB SINAD fdev=8 kHz (dBm) | RSSI dynamic range [typ] (dB) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SA605DK | No Longer Manufactured | SSOP20 | Single conversion receiver | 500 | 25 | 4.5 | 8 | 6.55@6 V | 10 | 5@45 MHz | -120 | 90 |
| SA605D | No Longer Manufactured | SO20 | Single conversion receiver | 500 | 25 | 4.5 | 8 | 6.55@6 V | 10 | 5@45 MHz | -120 | 90 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SA605DK/01 |  | SOT266-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | SA605DK/01,118 (9352 752 67118) | SA605DK | SA605DK/01 |    | week 12, 2005 | 0.0 | 2.0 | 5E8 | 1 | 1 |
| Bulk Pack | Active | SA605DK/01,112 (9352 752 67112) | SA605DK | SA605DK/01 | | week 12, 2005 | 0.0 | 2.0 | 5E8 | 1 | 1 | ||||
| SA605D/01 | | SOT163-1 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 13" Q1/T1 | Active | SA605D/01,118 (9352 752 66118) | SA605D | SA605D/01 | | week 12, 2005 | 0.0 | 2.0 | 5E8 | 1 | 1 |
| Bulk Pack | Active | SA605D/01,112 (9352 752 66112) | SA605D | SA605D/01 | | week 12, 2005 | 0.0 | 2.0 | 5E8 | 1 | 1 |
- Evaluating the SA605 SO and SSOP demo board SA605
- Demodulating at 10.7 MHz IF with the SA605 SA605
- High sensitivity applications of low-power RF/IF integrated circuits SA605
- Reviewing key areas when designing with the SA605 SA605
- An FM/IF system for DECT and other high speed GFSK applications SA639DH
- RF/IF building blocks for niche handheld devices SA639DH
- plastic shrink small outline package; 20 leads; body width 4.4 mm SA636
- SSOP-TSSOP-VSO-WAVE LPC1114FDH28
- SSOP20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... SA636
- SOT163-1 LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reel 13" Q1/T1 LPC812M101JD20
- SA605
- SA636
- SA615
