数据手册DataSheet 下载SI2304DS N沟道TrenchMOS中间电平FET.pdf

中间电平N沟道增强型场效应晶体管(FET),采用使用TrenchMOS技术的塑料封装。该产品仅设计适合用于计算、通信、消费电子和工业应用。

产品特点
  • 占用面积小,节省PCB空间
  • 快速开关特性,适用于高频应用
产品应用
  • 电池管理
  • 高速开关
  • 低功耗DC-DC转换器
订购型号
订购型号封装Outline versionReflow-/Wave soldering包装产品状态标示订购器件的编号
SI2304DSTO-236AB (SOT23)sot023_poReflow_Soldering_Profile
Wave_Soldering_Profile
Tape reel smd激活%2SSI2304DS,215( 9340 566 33215 )
SI2304DS/DGTO-236AB (SOT23)sot023_poReflow_Soldering_Profile
Wave_Soldering_Profile
Tape reel smd撤回替代产品ZU%SI2304DS/DG,215( 9340 617 75215 )
品质、可靠性及RoHS化学成分
订购型号订购器件的编号RoHS / RHF无铅开始日期EFRIFR (FIT)MTBF(小时)潮湿敏感度等级MSL LF
SI2304DSSI2304DS,215week 35, 2003220.01.029.79E811
SI2304DS/DGSI2304DS/DG,215Always Pb-free220.01.029.79E811
产品技术资料
文档标题类型分类格式更新日期
SI2304DS (中文):N-channel enhancement mode field-effect transistorData sheetpdf2001-08-20
AN10273:Power MOSFET single-shot and repetitive avalanche ruggedness ratingApplication notepdf2010-03-17
AN11158:Understanding power MOSFET data sheet parametersApplication notepdf2014-02-04
AN11243:Failure signature of Electrical Overstress on Power MOSFETsApplication notepdf2012-10-29
AN11158_ZH:Understanding power MOSFET data sheet parametersApplication notepdf2013-11-08
75017288:Broad small-signal MOSFET portfolio to suit a wide range of applicationsLine cardpdf2012-08-23
SI2304DS_NXP_Product_Quality:SI2304DS NXP Product QualityQuality documentpdf2014-04-22
SI2304DS_19_04_2012:SI2304DS Spice modelSPICE modellib2013-12-13
SOT23_235:Tape reel SMD; standard product orientation 12NC ending 235Packingpdf2013-02-05
SOT23_185:Tape reel SMD; standard product orientation 12NC ending 185Packingpdf2012-11-16
SOT23_215:Tape reel SMD; standard product orientation 12NC ending 215Packingpdf2012-11-16
Reflow_Soldering_Profile:Reflow Soldering ProfileReflow solderingpdf2013-09-30
Wave_Soldering_Profile:Wave Soldering ProfileWave solderingpdf2013-09-30
sot023_fr:Footprint for reflow soldering SOT023Reflow solderingpdf2010-07-13
sot023_fw:Footprint for wave soldering SOT023Wave solderingpdf2010-07-13
sot023_po:plastic surface-mounted package; 3 leadsOutline drawingpdf2009-10-08
N-channel enhancement mode field-effect transistor SI2304DS
Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7M12-60E
Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7K6R8-40E
Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
SI2304DS NXP Product Quality SI2304DS
SI2304DS Spice model SI2304DS
Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
Tape reel SMD; standard product orientation 12NC ending 185 BAT54S
Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Footprint for reflow soldering SOT023 PMBFJ309
Footprint for wave soldering SOT023 PMBFJ309
plastic surface-mounted package; 3 leads PMBFJ309