This single buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
The output of the SN74AUC1G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027
SN74AUC1G07 | |
Pin/Package | 5SC70 |
Operating Temperature Range(°C) | -40 to 85 |
IOL(mA) | 9 |
Voltage Nodes(V) | 2.5 |
IOH(mA) | -9 |
Input Level | 2.5V CMOS |
Vcc max(V) | 2.7 |
Technology Family | AUC |
Vcc min(V) | 0.8 |
Approx. Price (US$) | 0.13 | 1ku |
Output Level | 2.5V CMOS |
No. of Gates | 1 |
tpd max(ns) | 1.8 |
ICC(uA) | 10 |
Voltage Node(V) | 2.5 |
Rating | Catalog |
器件 | 状态 | 温度 | 价格(美元) | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
SN74AUC1G07DCKR | ACTIVE | -40 to 85 | 0.13 | 1ku | SC70 (DCK) | 5 | 3000 | LARGE T&R | UVR |
SN74AUC1G07DCKRG4 | ACTIVE | -40 to 85 | 0.13 | 1ku | SC70 (DCK) | 5 | 3000 | LARGE T&R | UVR |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
SN74AUC1G07DCKR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUC1G07DCKR | SN74AUC1G07DCKR |
SN74AUC1G07DCKRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUC1G07DCKRG4 | SN74AUC1G07DCKRG4 |