The AUP family is TI’s premier solution to the industry’s low power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).
The output of this single buffer/driver is open drain, and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff
| SN74AUP1G07 | |
| Pin/Package | 5SC70 |
| Operating Temperature Range(°C) | -40 to 85 |
| IOL(mA) | 4 |
| Voltage Nodes(V) | 3.3 |
| Logic | True |
| Static Current | 0.0005 |
| Output Drive(mA) | 4 |
| Technology Family | AUP |
| Approx. Price (US$) | 0.13 | 1ku |
| No. of Outputs | 1 |
| Vcc range(V) | 0.8 to 3.6 |
| tpd max(ns) | 3.3,4.5,6.1,10.4 |
| ICC(uA) | 0.9 |
| Rating | Catalog |
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74AUP1G07DCKR | ACTIVE | -40 to 85 | 1.60 | 1ku | SC70 (DCK) | 5 | 3000 | LARGE T&R | HVR |
| SN74AUP1G07DCKRG4 | ACTIVE | -40 to 85 | 1.60 | 1ku | SC70 (DCK) | 5 | 3000 | LARGE T&R | HVR |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74AUP1G07DCKR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | SN74AUP1G07DCKR | SN74AUP1G07DCKR |
| SN74AUP1G07DCKRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | SN74AUP1G07DCKRG4 | SN74AUP1G07DCKRG4 |
