These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus depending upon the logic level at the direction-control (DIR) input. The output enable input can be used to disable the device so the buses are effectively isolated.
The SN74F245 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F245 is characterized for operation from 0°C to 70°C
器件 | 状态 | 温度 | 价格(美元) | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
SN74F245DW | ACTIVE | -40 to 85 | 1.15 | 1ku | SOIC (DW) | 20 | 25 | TUBE | |
SN74F245DWE4 | ACTIVE | -40 to 85 | 1.15 | 1ku | SOIC (DW) | 20 | 25 | TUBE | |
SN74F245DWG4 | ACTIVE | -40 to 85 | 1.15 | 1ku | SOIC (DW) | 20 | 25 | TUBE |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
SN74F245DW | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74F245DW | SN74F245DW |
SN74F245DWE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74F245DWE4 | SN74F245DWE4 |
SN74F245DWG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74F245DWG4 | SN74F245DWG4 |