SN65MLVD047A 双路 LVDS 发送器/接收器
The SN65MLVD047A is a quadruple line driver that complies with the TIA/EIA-899 standard, Electrical Characteristics of Multipoint-Low-Voltage Differential Signaling (M-LVDS). The output current of this M-LVDS device has been increased, in comparison to standard LVDS compliant devices, in order to support doubly terminated transmission lines and heavily loaded backplane bus applications. Backplane applications generally require impedance matching termination resistors at both ends of the bus. The effective impedance of a doubly terminated bus can be as low as 30 . The SN65MLVD047A devices allow for multiple drivers to be present on a single bus. SN65MLVD047A drivers are high impedance when disabled or unpowered. Driver edge rate control is incorporated to support operation.
SN65LVDM050
No. of Tx
4
Input Signal
LVTTL
Output Signal
M-LVDS
Signaling Rate(Mbps)
200
Supply Voltage(s)(V)
3.3
ICC(Max)(mA)
70
Peak-to-Peak Jitter(Max)(ps)
36
Part-to-Part Skew(Max)(ps)
600
Tx tpd(Typ)(ns)
2.4
Pin/Package
16SOIC, 16TSSOP
Operating Temperature Range(�C)
-40 to 85
ESD HBM(kV)
9
SN65MLVD047A 特性
Differential Line Drivers for 30- Loads and Data Rates(1) Up to 200 Mbps, Clock Frequencies up to 100 MHz
Supports Multipoint Bus Architectures
Meets the Requirements of TIA/EIA-899
Operates from a Single 3.3-V Supply
Characterized for Operation from -40°C to 85°C
16-Pin SOIC (JEDEC MS-012) and 16-Pin TSSOP (JEDEC MS-153) Packaging
APPLICATIONS
AdvancedTCA™ (ATCA™) Clock Bus Driver
Clock Distribution
Backplane or Cabled Multipoint Data Transmission in Telecommunications, Automotive, Industrial, and Other Computer Systems
Cellular Base Stations
Central-Office and PBX Switching
Bridges and Routers
Low-Power High-Speed Short-Reach Alternative to TIA/EIA-485
SN65MLVD047A 芯片订购指南
器件
状态
温度
价格
封装 | 引脚
封装数量 | 封装载体
丝印标记
SN65MLVD047AD
ACTIVE
-40 to 85
1.75 | 1ku
SOIC (D) | 16
40 | TUBE
SN65MLVD047ADG4
ACTIVE
-40 to 85
1.75 | 1ku
SOIC (D) | 16
40 | TUBE
SN65MLVD047ADR
ACTIVE
-40 to 85
1.45 | 1ku
SOIC (D) | 16
2500 | LARGE T&R
SN65MLVD047ADRG4
ACTIVE
-40 to 85
1.45 | 1ku
SOIC (D) | 16
2500 | LARGE T&R
SN65MLVD047APW
ACTIVE
-40 to 85
1.75 | 1ku
TSSOP (PW) | 16
90 | TUBE
SN65MLVD047APWG4
ACTIVE
-40 to 85
1.75 | 1ku
TSSOP (PW) | 16
90 | TUBE
SN65MLVD047APWR
ACTIVE
-40 to 85
1.45 | 1ku
TSSOP (PW) | 16
2000 | LARGE T&R
SN65MLVD047APWRG4
ACTIVE
-40 to 85
1.45 | 1ku
TSSOP (PW) | 16
2000 | LARGE T&R
SN65MLVD047A 质量与无铅数据
器件
环保计划*
铅/焊球涂层
MSL 等级/回流焊峰
环保信息与无铅 (Pb-free)
DPPM / MTBF / FIT 率
SN65MLVD047AD
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD047AD
SN65MLVD047AD
SN65MLVD047ADG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD047ADG4
SN65MLVD047ADG4
SN65MLVD047ADR
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD047ADR
SN65MLVD047ADR
SN65MLVD047ADRG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD047ADRG4
SN65MLVD047ADRG4
SN65MLVD047APW
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD047APW
SN65MLVD047APW
SN65MLVD047APWG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD047APWG4
SN65MLVD047APWG4
SN65MLVD047APWR
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD047APWR
SN65MLVD047APWR
SN65MLVD047APWRG4
Green (RoHS & no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65MLVD047APWRG4
SN65MLVD047APWRG4
SN65MLVD047A 应用技术支持与电子电路设计开发资源下载
SN65MLVD047A 数据资料 dataSheet 下载 .PDF
TI 德州仪器M-LVDS PHYs选型与价格 . xls
所选封装材料的热学和电学性质 (PDF 645 KB)
使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
接口选择指南 (Rev. D) (PDF 2994 KB)
Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
Isolated RS-485 Reference Design (PDF 80 KB)
无铅组件涂层的保存期评估 (PDF 1305 KB)
Analog Signal Chain Guide (8.62 MB)
Industrial Interface IC Solutions (101 KB)