UC3770B 高性能步进电机驱动电路

UC3770B 描述

The UC3770A and UC3770B are high-performance full bridge drivers that offer higher current and lower saturation voltage than the UC3717 and the UC3770. Included in these devices are LS-TTL compatible logic inputs, current sense, monostable, thermal shutdown, and a power H-bridge output stage. Two UC3770As or UC3770Bs and a few external components form a complete micro-processor-controllable stepper motor power system. Unlike the UC3717, the UC3770A and the UC3770B require external high-side clamp diodes. The UC3770A and UC3770B are identical in all regards except for the current sense thresholds. Thresholds for the UC3770B are identical to those of the older UC3717 permitting drop-in replacement in applications where high-side diodes are not required.

UC3770B
Operating Supply(Min)(V) 10  
Operating Supply(Max)(V) 45  
Operating Supply Current(mA) 33  
Peak Output Current(A) 1.5  
Pin/Package 16PDIP  
Rating Catalog
UC3770B 特性
UC3770B 芯片订购指南
器件 状态 温度 (oC) 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
UC3770BN ACTIVE 0 to 70 3.15 | 1ku PDIP (N) | 16 25 | TUBE UC3770BN
UC3770BNG4 ACTIVE 0 to 70 3.15 | 1ku PDIP (N) | 16 25 | TUBE UC3770BN
UC3770BQ ACTIVE 0 to 70 3.15 | 1ku PLCC (FN) | 28 37 | TUBE UC3770BQ
UC3770BQTR ACTIVE 0 to 70 2.60 | 1ku PLCC (FN) | 28 750 | LARGE T&R UC3770BQ
UC3770B 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
UC3770BN Green (RoHS & no Sb/Br)  CU NIPDAU  N/A for Pkg Type UC3770BN UC3770BN
UC3770BNG4 Green (RoHS & no Sb/Br)  CU NIPDAU  N/A for Pkg Type UC3770BNG4 UC3770BNG4
UC3770BQ Green (RoHS & no Sb/Br)  CU NIPDAU  Level-3-260C-168 HR UC3770BQ UC3770BQ
UC3770BQG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-3-260C-168 HR UC3770BQG4 UC3770BQG4
UC3770B 应用技术支持与电子电路设计开发资源下载
  1. UC3770B 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器运动/电机控制产品选型与价格 . xls
  3. PowerPAD™ Thermally Enhanced Package   (PDF  1040 KB)
  4. 全面认识开关型电源中的BUCK-BOOST功率级 (Rev. A)   (PDF  2206 KB)
  5. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  6. PowerPAD™ Made Easy (PDF 57 KB)
  7. 标准线性产品交叉参考 (Rev. D)   (PDF  1058 KB)
  8. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  9. 所选封装材料的热学和电学性质 (PDF 645 KB)
  10. 高速数据转换 (PDF 1967 KB)
UC3770B 相关工具
名称 型号 公司 工具/软件类型
UC3770B 评估模块 UC3770BEVM Texas Instruments 开发电路板/EVM