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SFP Thin Film Top-Contact Resistor with Part Mark

技术特性

• Wire bondable
• Part marked - 5 digits
• Small size: 0.022 inches square

Datasheet

• SFP

Packaging Information

• Waffle Pack Packaging - Vishay Electro-Films Waffle Pack Quantity Per Product Family

Product Literature

• Selector Guide - Military and Aerospace Applications