MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz
The MASW-009276-000DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. The MASW-009276-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. This device is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg (2.5%) solder bumps for Wafer Level Chip Scale Package (WLCSP) applications.
技术特性 Features
- 802.11b/g and Bluetooth Applications
- Low Insertion Loss:
0.5 dB 2.4 GHz to 2.5 GHz band
- High Isolation: 32 dB Typical on RX
- Low Harmonics: <-70 dBc @ 20 dBm
- Flip-chip configuration
- RoHS* Compliant
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订购信息 Ordering Information
- MASW-009276-000D3K Die in 3000 piece reel
- MASW-009276-001SMB Sample Board SP3T
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