PAL16R8AM 标准高速 PAL 电路
These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.
The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.
The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C
| PAL16R8AM | |
| Voltage Nodes(V) | 5 |
| Rating | Military |
PAL16R8AM 特性
- Choice of Operating Speeds
- High-Speed, A Devices . . . 25 MHz Min
- Half-Power, A-2 Devices . . . 16 MHz Min
- Choice of Input/Output Configuration
- Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
PAL16R8AM 芯片订购指南
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| PAL16R8AMFKB | ACTIVE | -55 to 125 | 20.13 | 1ku | LCCC (FK) | 20 | 1 | TUBE | |
| PAL16R8AMJ | ACTIVE | -55 to 125 | 10.05 | 1ku | CDIP (J) | 20 | 1 | TUBE | |
| PAL16R8AMJB | ACTIVE | -55 to 125 | 13.41 | 1ku | CDIP (J) | 20 | 1 | TUBE | |
| PAL16R8AMWB | ACTIVE | -55 to 125 | 26.83 | 1ku | CFP (W) | 20 | 1 | TUBE |
PAL16R8AM 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| PAL16R8AMFKB | TBD | POST-PLATE | N/A for Pkg Type | PAL16R8AMFKB | PAL16R8AMFKB |
| PAL16R8AMJ | TBD | A42 | N/A for Pkg Type | PAL16R8AMJ | PAL16R8AMJ |
| PAL16R8AMJB | TBD | A42 | N/A for Pkg Type | PAL16R8AMJB | PAL16R8AMJB |
| PAL16R8AMWB | TBD | Call TI | N/A for Pkg Type | PAL16R8AMWB | PAL16R8AMWB |
PAL16R8AM 应用技术支持与电子电路设计开发资源下载
- PAL16R8AM 数据资料 dataSheet 下载.PDF
- TI 德州仪器特殊逻辑产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)
