TLV5624 8 位 1.0 至 3.5us DAC,具有串行输入、可编程内部参考和稳定时间

TLV5624 同类产品
TLV5624 说明

The TLV5624 is a 8-bit voltage output DAC with a flexible 4-wire serial interface. The serial interface allows glueless interface to TMS320 and SPI™, QSPI™, and Microwire™ serial ports. It is programmed with a 16-bit serial string containing 4 control and 8 data bits.

The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The programmable settling time of the DAC allows the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage reference, the TLV5624 simplifies overall system design.

Because of its ability to source up to 1 mA, the reference can also be used as a system reference. Implemented with a CMOS process, the device is designed for single supply operation from 2.


TLV5623 TLV5624 TLV5625 TLV5626
Resolution(Bits) 8   8   8   8  
DAC: Channels 1   1   2   2  
Settling Time(µs) 3   1   3   0.8  
Sample / Update Rate(MSPS) 0.102   0.233   0.093   0.278  
Interface Serial SPI   Serial SPI   Serial SPI   Serial SPI  
Output Type Voltage   Voltage   Voltage   Voltage  
Output Range Min.(V or mA) 0   0   0   0  
Output Range Max.(V or mA) 5.1   5.1   5.1   5.1  
Single/Dual Analog Supply +   +   +   +  
DNL(Max)(+/-LSB) 0.2   0.2   0.2   0.5  
INL(Max)(+/-LSB) 0.5   0.5   0.5   1  
INL (+/-)(Max)(%) 0.2   0.2   0.2   0.4  
Monotonicity 8   8   8   8  
SNR(Typ)(dB) 57   57   54   57  
SFDR(Typ)(dB) 60   62   50   62  
Power Consumption(Typ)(mW) 2.1   0.9   2.4   4.2  
Architecture String   String   String   String  
Reference: Type Ext   Int/Ext   Ext   Int/Ext  
Analog Voltage AV/DD(Min)(V) 2.7   2.7   2.7   2.7  
Analog Voltage AV/DD(Max)(V) 5.5   5.5   5.5   5.5  
Logic Voltage DV/DD(Min)(V) 2.7   2.7   2.7   2.7  
Logic Voltage DV/DD(Max)(V) 5.5   5.5   5.5   5.5  
No. of Supplies (Unipolar) 1   1   1   1  
Rating Catalog   Catalog   Catalog   Catalog  
Pin/Package 8MSOP, 8SOIC   8MSOP, 8SOIC   8SOIC   8SOIC  
Approx. Price (US$) 0.99 | 1ku   1.60 | 1ku   1.70 | 1ku   1.90 | 1ku  
Thermal Shutdown No   No   No   No  
Operating Temperature Range(°C) -40 to 85,0 to 70   -40 to 85,0 to 70   -40 to 85,0 to 70   -40 to 85,0 to 70
TLV5624 特性
TLV5624 芯片订购指南
器件 状态 温度 (oC) 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLV5624CD ACTIVE 0 to 70 1.60 | 1ku SOIC (D) | 8 75 | TUBE 5624C
TLV5624CDG4 ACTIVE 0 to 70 1.60 | 1ku SOIC (D) | 8 75 | TUBE 5624C
TLV5624CDGK ACTIVE 0 to 70 1.75 | 1ku MSOP (DGK) | 8 80 | TUBE 5624C
TLV5624CDGKG4 ACTIVE 0 to 70 1.75 | 1ku MSOP (DGK) | 8 80 | TUBE 5624C
TLV5624CDGKR ACTIVE 0 to 70 1.60 | 1ku MSOP (DGK) | 8 2500 | LARGE T&R 5624C
TLV5624CDGKRG4 ACTIVE 0 to 70 1.60 | 1ku MSOP (DGK) | 8 2500 | LARGE T&R 5624C
TLV5624ID ACTIVE -40 to 85 1.90 | 1ku SOIC (D) | 8 75 | TUBE 5624I
TLV5624IDG4 ACTIVE -40 to 85 1.90 | 1ku SOIC (D) | 8 75 | TUBE 5624I
TLV5624IDGK ACTIVE -40 to 85 1.90 | 1ku MSOP (DGK) | 8 80 | TUBE 5624I
TLV5624IDGKG4 ACTIVE -40 to 85 1.90 | 1ku MSOP (DGK) | 8 80 | TUBE 5624I
TLV5624IDGKR ACTIVE -40 to 85 1.70 | 1ku MSOP (DGK) | 8 2500 | LARGE T&R 5624I
TLV5624IDGKRG4 ACTIVE -40 to 85 1.70 | 1ku MSOP (DGK) | 8 2500 | LARGE T&R 5624I
TLV5624IDR ACTIVE -40 to 85 1.70 | 1ku SOIC (D) | 8 2500 | LARGE T&R 5624I
TLV5624IDRG4 ACTIVE -40 to 85 1.70 | 1ku SOIC (D) | 8 2500 | LARGE T&R 5624I
TLV5624 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLV5624CD Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5624CD
TLV5624CDG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5624CDG4 TLV5624CDG4
TLV5624CDGK Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5624CDGK
TLV5624CDGKG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5624CDGKG4 TLV5624CDGKG4
TLV5624CDGKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5624CDGKR
TLV5624CDGKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5624CDGKRG4 TLV5624CDGKRG4
TLV5624ID Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5624ID
TLV5624IDG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5624IDG4 TLV5624IDG4
TLV5624IDGK Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5624IDGK
TLV5624IDGKG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5624IDGKG4 TLV5624IDGKG4
TLV5624IDGKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5624IDGKR
TLV5624IDGKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5624IDGKRG4 TLV5624IDGKRG4
TLV5624IDR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM   TLV5624IDR
TLV5624IDRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TLV5624IDRG4 TLV5624IDRG4
TLV5624 应用技术支持与电子电路设计开发资源下载
  1. TLV5624 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器仪DAC 模数转换器产品选型与价格 . xls
  3. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  4. 所选封装材料的热学和电学性质 (PDF 645 KB)
  5. 高速数据转换 (PDF 1967 KB)
  6. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  7. Analog-to-Digital Converter Grounding Practices Affect System Performance (PDF 56 KB)
  8. Principles of Data Acquisition and Conversion (PDF 50 KB)
  9. Interleaving Analog-to-Digital Converters (PDF 64 KB)
  10. What Designers Should Know About Data Converter Drift (PDF 95 KB)
  11. Giving Delta-Sigma Converters a Gain Boost with a Front End Analog Gain Stage (PDF 70 KB)
  12. Programming Tricks for Higher Conversion Speeds Utilizing Delta Sigma Converters (PDF 105 KB)
TLV5624 工具与软件
名称 型号 公司 工具/软件类型
TLV5624 评估模块 TLV5624EVM Texas Instruments 开发电路板/EVM
针对 Code Composer Studio 的 DCPFREETOOL 软件插件 DCPFREETOOL Texas Instruments 实用程序/插件
MDACBufferPro Design Utility for Multiplying Digital to Analog Converter Design MDACBUFFERPRO Texas Instruments  应用软件