TQM776011 WCDMA / HSUPA 功率放大器模块, 集成双工器

The TQM776011 is fully matched Power Amplifier Module designed for use in WCDMA UMTS Band 1, CDMA BC6 (IMT) & LTE handsets. Its compact 3x3mm package including a coupler and built-in voltage regulator makes it ideal for today’s extremely small data enabled phones. Its RF performance meets the stringent linearity requirements for multi-mode operation. The TQM776011 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip® assembly offering state of the art reliability, temperature stability and ruggedness. The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time over the entire range of operating conditions. To simplify the cost/time of calibration while in production the TQM776011 can be used in 1-bit operation; either LPM/HPM with only 4mA of IcQ up to +13dBm in LPM, or MPM/HPM with 9mA of IcQ up to +17dBm in MPM.

技术特性
  • GaAs BiHEMT / CuFlip® PA Technology
  • Typical Quiescent Current values:
    • LPM: 4 mA
    • MPM: 9 mA
    • HPM: 90 mA
  • Excellent Linearity in all modes
  • Excellent Phase Discontinuity
  • Integrated high performance coupler
  • Built-in voltage regulator functionality eliminating any external switch circuitry
  • Small 10-pin, 3x3mm module
  • Lead-free 260°C / RoHS / Halogen-free
  • Full ESD protection
订购信息 Ordering Information
  • TQM776011
应用领域 APPLICATION
  • WCDMA B1 Applications
  • CDMA2000 IMT (BC6) Applications
  • HSDPA/HSUPA/HSPA+ Applications
  • LTE-Compatible Applications
技术指标
尺寸 频段 特点
4.0 x 4.0 x 0.9 Band 1 2-Bit (Hi / Med / Lo Power Modes)
功能框图 Functional Block Diagram

TQM776011 功能框图

应用技术支持与电子电路设计开发资源下载 版本信息 大小
TQM776011 数据资料DataSheet下载:pdf Rev.V2 2 页