TQM776011 WCDMA / HSUPA 功率放大器模块, 集成双工器
The TQM776011 is fully matched Power Amplifier Module designed for use in WCDMA UMTS Band 1, CDMA BC6 (IMT) & LTE handsets. Its compact 3x3mm package including a coupler and built-in voltage regulator makes it ideal for today’s extremely small data enabled phones. Its RF performance meets the stringent linearity requirements for multi-mode operation. The TQM776011 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip® assembly offering state of the art reliability, temperature stability and ruggedness. The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time over the entire range of operating conditions. To simplify the cost/time of calibration while in production the TQM776011 can be used in 1-bit operation; either LPM/HPM with only 4mA of IcQ up to +13dBm in LPM, or MPM/HPM with 9mA of IcQ up to +17dBm in MPM.
技术特性
- GaAs BiHEMT / CuFlip® PA Technology
- Typical Quiescent Current values:
- LPM: 4 mA
- MPM: 9 mA
- HPM: 90 mA
- Excellent Linearity in all modes
- Excellent Phase Discontinuity
- Integrated high performance coupler
- Built-in voltage regulator functionality eliminating any external switch circuitry
- Small 10-pin, 3x3mm module
- Lead-free 260°C / RoHS / Halogen-free
- Full ESD protection
订购信息 Ordering Information
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应用领域 APPLICATION
- WCDMA B1 Applications
- CDMA2000 IMT (BC6) Applications
- HSDPA/HSUPA/HSPA+ Applications
- LTE-Compatible Applications
技术指标
尺寸 |
频段 |
特点 |
4.0 x 4.0 x 0.9 |
Band 1 |
2-Bit (Hi / Med / Lo Power Modes) |
功能框图 Functional Block Diagram
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