Winbond Electronics Corp. (Taiwan) is now sampling a highly integrated S/T chip for the ISDN USB TA market. The W6694BCD complies with the ITU I.430 standard as well as USB 1.0/1.1 specification. This new chip integrates S/T transceiver, USB SIE/SIL, voltage regulator and a rate adaptation mechanism for 128K Internet access. In addition, PCM port and B-channel switching are built-in for voice application.
W6694BCD also includes a GCI bus and general purpose I/Os for expansion and control devices. The W6694BCD-based evaluation board is qualified by Tektronix ISDN K1403 tester. It also meets requirements of USB high power current by consuming only 2.39 mA in suspend mode.
The chip is intended for pure passive design by high performance computing power of modern PC. The W6694BCD is easy to be designed as smallest possible mechanism for portable users and desktop users for their access into Internet without power supply. Moreover, Internet users receive the merit of hot plug via USB port. For remote users, remote access can be easily achieved by waking up host through internal intelligent features in the chip.
To simplify the design effort, Winbond offers an evaluation board, sample code, data sheet and chip samples in 48-pin LQFP package. The W6694BCD is supported by the leaders in the field of protocol, application software and transformer suppliers listed as below.
