| TO293Bxxx | TO-CAN 封装 1.3μm DFB 芯片，适合非制冷应用、CWDM | 2.5 | Gb/s | TO can | NA | Single Mode | N/A | 1270-1450 | DFB | Y with exemptions | Active |
| TO295J | TO-CAN 封装 1.5μm DFB 芯片，适合非制冷应用 | 2.5 | Gb/s | TO can | NA | Single Mode | N/A | 1550 | DFB | Y with exemptions | Active |
| TO295Jxxx | TO-CAN 封装 1.5μm DFB 芯片，适合非制冷应用、CWDM | 2.5 | Gb/s | TO can | NA | Single Mode | N/A | 1470-1610 | DFB | Y with exemptions | Active |
| TO295J149x | TO-CAN 封装 1.49μm DFB 芯片，适合 FTTx 应用 | 2.5 | Gb/s | TO can | NA | Single Mode | N/A | 1490 | DFB | Y with exemptions | Active |
| TO299K | TO-CAN 封装 1.3μm FP 芯片，适合广温度范围 10Gb/s 无制冷应用达 1 公里 | 10 | Gb/s | TO can | NA | Single Mode | 2 | 1310 | FP | Y with exemptions | Active |
| TO293K | TO-CAN 封装 1.3μm DFB 芯片，适合广温度范围 10Gb/s 无制冷应用达 20 公里 | 10 | Gb/s | TO can | NA | Single Mode | N/A | 1310 | DFB | Y with exemptions | Active |
| TO293B1xxT | TO-CAN 封装 TO293 CWDM 系列 1270nm 到 1450nm DFB，适合 10Gb/s 应用 | 10 | Gb/s | TO can | NA | Single Mode | N/A | 1270-1450 | DFB | Y with exemptions | Active |
| TO293Bx | 1.3 μm DFB chip in TO-can for Uncooled applications | 2.5 | Gb/s | TO can | NA | Single Mode | N/A | 1310 | DFB | Y with exemptions | Active |
