CY7C1061AV33-10BAXI
数据手册DataSheet 下载
CY7C1061AV33:16-Mbit (1 M × 16) Static RAM(pdf, 537.21 KB)
数据手册更新日期：August 11, 2015
CY7C1061AV33-10BAXI
| 合格汽车 | 否 |
|---|
| 密度 (Kb) | 16384 |
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| 频率 (MHz) | 无 |
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| 最高工作温度 (°C) | 85 |
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| Max. Operating VCCQ (V) | 3.60 |
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| 最高工作电压 (V) | 3.60 |
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| 最低工作温度 (°C) | -40 |
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| Min. Operating VCCQ (V) | 3.00 |
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| 最低工作电压 (V) | 3.00 |
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| 组织 (X x Y) | 1M x 16 |
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| 速率 (ns) | 10 |
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| 温度分类 | 工业 |
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封装与供应信息 Packaging/Ordering
| 工具包 | FBGA |
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| No. of Pins | 60 |
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| Package Dimensions | 788 L x 1.2 H x 315 W (Mils) |
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| Package Weight | 329.45 (mgs) |
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| Package Cross Section Drawing | 下载 |
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| Package Carrier | TRAY |
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| Package Carrier Drawing / Orientation | , Drawing；Package Orientation |
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| Standard Pack Quantity | 120 |
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| Minimum Order Quantity (MOQ) | 120 |
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| Order Increment | 120 |
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| Estimated Lead Time (days) | 42 |
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| HTS Code | 8542.32.0040 |
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| ECCN | (B.2.B.) |
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| ECCN Suball | 3A991 |
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品质与环保 Quality and RoHS
封装材料声明
IPC 1752 材料成分声明
RoHS 分析证书 (CoA)
- PACKAGE ROHS ANALYSIS REPORT - BGA (BK/BP 36, 42, 48, 96) (BW 96,100,119,144,165,200,000,000,000,000) USING MOLD COMPOUND KEG2270, ADHESIVE 2025D, SAC405 - ASE TAIWAN ASSEMBLY Last Update: 2012 年 7 月 04 日
RoHS Analysis Certificates (CoA) for Direct Materials
Package Qualification Report
Device Qualification Reports
应用笔记 (1)
| 文件标题 | 下载 |
| AN6081 - Interfacing 90-nm Cypress Asynchronous SRAMs in Legacy Systems | |
模型 (2)
| 文件标题 | 下载 |
| CY7C1061AV33-VHDL | |
| CY7C1061AV33-10ZC-Ibis | |
产品变更通知 (PCN) (4)
| 文件标题 | 下载 |
| PCN074585 | |
| PCN125145 | |
| PCN125157 | |
| PCN125175 | |
Product Information Notice (PIN) (1)
PCN (1)
白皮书 (1)
| 文件标题 | 下载 |
| SRAM Board Design Guidelines | |
RoHS Analysis Certificates (CoA) for Direct Materials (1)
