CY7C1570KV18-450BZXI
数据手册DataSheet 下载
CY7C1568KV18, CY7C1570KV18:72-Mbit DDR II+ SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency)(pdf, 872.25 KB)
数据手册更新日期：November 23, 2015
CY7C1570KV18-450BZXI
| 架构 | DDR-II+ CIO |
|---|---|
| 合格汽车 | 否 |
| 突发长度（字） | 2 |
| 密度 (Kb) | 73728 |
| Density (Mb) | 72 |
| 频率 (MHz) | 450 |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 1.90 |
| 最高工作电压 (V) | 1.90 |
| 最低工作温度 (°C) | -40 |
| Min. Operating VCCQ (V) | 1.40 |
| 最低工作电压 (V) | 1.70 |
| 组织 (X x Y) | 2Mb x 36 |
| 温度分类 | 工业 |
封装与供应信息 Packaging/Ordering
| 工具包 | FBGA |
|---|---|
| No. of Pins | 165 |
| Package Dimensions | 591 L x 1.4 H x 512 W (Mils) |
| Package Weight | 499.56 (mgs) |
| Package Cross Section Drawing | 下载 |
| Package Carrier | TRAY |
| Package Carrier Drawing / Orientation | , Drawing；Package Orientation |
| Standard Pack Quantity | 136 |
| Minimum Order Quantity (MOQ) | 136 |
| Order Increment | 136 |
| Estimated Lead Time (days) | 35 |
| HTS Code | 8542.32.0040 |
| ECCN | (B.2.A.) |
| ECCN Suball | 3A991 |
品质与环保 Quality and RoHS
| Moisture Sensitivity Level (MSL) | 3 |
|---|---|
| Peak Reflow Temp. (°C) | 260 () Cypress Reflow Profile |
| 符合有害物质限制 (RoHS) 标准 | Y Print RoHS Certificate of Compliance |
| 无铅 | 是 |
| Lead/Ball Finish | Sn/Ag/Cu |
| Marking | Cypress Marking Format |
封装材料声明
- 165-FBGA (13 X 15 MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 2015 年 10 月 21 日
IPC 1752 材料成分声明
- 165-FBGA - 001-80436 Last Update: 2013 年 6 月 25 日
RoHS 分析证书 (CoA)
- PACKAGE ROHS ANALYSIS REPORT - BGA (BW165) USING MOLD COMPOUND CK7000LA, ADHESIVE QMI506 AND SAC405 - CML ASSEMBLY Last Update: 2012 年 7 月 04 日
RoHS Analysis Certificates (CoA) for Direct Materials
Package Qualification Report
- Qtp 50704 165ball Fine Pitch Ball Grid Array (fbga) (15 X 17 X 1.4mm And 13 X 15 X 1.4mm) Msl3, 260c Solder Reflow Ase-taiwan (g).pdf Last Update: 2015 年 8 月 07 日
- QTP#094002:165-BALL FINE PITCH BALL GRID ARRAY (FBGA) (13X15X1.4MM), SNAGCU, MSL3, 260C REFLOW CML-RA Last Update: 2015 年 5 月 22 日
Device Qualification Reports
- QTP 091706:LL65 72 MEG QDR/DDR SYNCHRONOUS PRODUCT QUALIFICATION REPORT Last Update: 2014 年 9 月 10 日
应用笔记 (5)
模型 (3)
| 文件标题 | 下载 |
| CY7C1570KV18 - Verilog |
|
| CY7C1570KV18 - IBIS |
|
| CY7C1570KV18 - BSDL |
|
产品变更通知 (PCN) (8)
| 文件标题 | 下载 |
| PCN094844 |
|
| PCN115104 |
|
| PCN125145 |
|
| PCN125174 |
|
| PCN155371 |
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| PCN154102 |
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| PCN125157 |
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| PCN125175 |
|
Product Information Notice (PIN) (1)
| 文件标题 | 下载 |
| PIN145277 |
|
Product Termination Notice (PTN) (1)
| 文件标题 | 下载 |
| PTN155003 |
|
RoHS Analysis Certificates (CoA) for Direct Materials (1)
| 文件标题 | 下载 |
