CY7C60413-16LKXCKG
CY7C60413-16LKXCKG
| CPU Core | M8C |
|---|---|
| 合格汽车 | 否 |
| RAM Size (Bytes) | 1024 |
| Max. Speed (MHz) | 24 |
| Code Memory Size (KB) | 8 |
| I/O 数目 | 13 |
| 最高工作温度 (°C) | 70 |
| 最低工作温度 (°C) | 0 |
| 最高工作电压 (V) | 3.60 |
| 最低工作电压 (V) | 1.71 |
| I/O 选项 | GPIO, I2C, SPI, ADC |
| 应用 | Wireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications |
| Code Memory Architecture | 闪存 |
封装与供应信息 Packaging/Ordering
| 工具包 | QFN |
|---|---|
| No. of Pins | 16 |
| Package Dimensions | 118 L x 23 H x 118 W (Mils) |
| Package Weight | 15.57 (mgs) |
| Package Cross Section Drawing | 下载 |
| Package Carrier | TRAY |
| Package Carrier Drawing / Orientation | , Drawing；Package Orientation |
| Standard Pack Quantity | 490 |
| Minimum Order Quantity (MOQ) | 490 |
| Order Increment | 490 |
| Estimated Lead Time (days) | 42 |
| HTS Code | 8542.31.0000 |
| ECCN | 3A991 |
| ECCN Suball | (A.3) |
品质与环保 Quality and RoHS
| Moisture Sensitivity Level (MSL) | 3 |
|---|---|
| Peak Reflow Temp. (°C) | 260 () Cypress Reflow Profile |
| 符合有害物质限制 (RoHS) 标准 | Y Print RoHS Certificate of Compliance |
| 无铅 | 是 |
| Lead/Ball Finish | Ni/Pd/Au |
| Marking | Cypress Marking Format |
封装材料声明
- 16L - QFN 3X3X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PMDD Last Update: 2014 年 2 月 20 日
IPC 1752 材料成分声明
- IPC-1752-2_V1.1_QFN16_AMKOR PHIL_LG Last Update: 2014 年 6 月 19 日
- IPC-1752-2_V1.1_QFN16_CARSEM_LG Last Update: 2014 年 6 月 19 日
- IPC-1752-2_V1.1_QFN16_ASE TAIWAN_LG16A Last Update: 2012 年 7 月 31 日
RoHS 分析证书 (CoA)
- PACKAGE ROHS ANALYSIS REPORT - QFN (16A) USING MOLD COMPOUND EMEG770H, ADHESIVE 8006NS, NIPDAU - CARSEM MALAYSIA ASSEMBLY Last Update: 2012 年 7 月 04 日
- PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE ATB-120A, NIPDAU-AG - AMKOR KOREA (K1) ASSEMBLY Last Update: 2012 年 7 月 04 日
- PACKAGE ROHS ANALYSIS REPORT - QFN (LG16) USING MOLD COMPOUND G700, ADHESIVE NEX130C, NIPDAU-AG - AMKOR PHILS. (P3) ASSEMBLY Last Update: 2012 年 7 月 04 日
- PACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSEMBLYPACKAGE ROHS ANALYSIS REPORT - QFN (LT 40B,48E, LG16, LQ44) USING MOLD COMPOUND G631H, ADHESIVE FH-900, NIPDAU - ASE TAIWAN ASSE... Last Update: 2012 年 7 月 03 日
Package Qualification Report
- QTP 112603:16 QFN (3X3X0.6MM), NIPDAU-AG, MSL3 260C REFLOW ASEK- TAIWAN Last Update: 2014 年 9 月 05 日
应用笔记 (10)
| 文件标题 | 下载 |
| AN17581 - WirelessUSB™ LP RDK Japanese Radio Law Testing and Verification | |
| AN79455 - Getting Started with WirelessUSB™-LP Radio and enCoRe™ V LV | |
| AN6066 - Wireless Binding Methodologies |
|
| AN2373 - Ranking Original Pseudo-Noise Codes in a DSSS System |
|
| AN4004 - Interference Mitigation Challenges and Solutions in the 2.4 to 2.5 GHz ISM Band | |
| AN64285 - Wirelessusb™ NL Low Power Radio Recommended Usage and PCB Layout | |
| AN5033 - WirelessUSB™ Dual Antenna Design Layout Guidelines |
|
| AN43353 - Using enCoRe™ V 16-Bit Timer Modules as PWMs |
|
| AN4003 - WirelessUSB™ 2-Way HID Systems |
|
| AN15257 - Guidelines for Evaluating System Performance of Cypress WirelessUSB™ RF Products |
