CYV15G0203TB-BGXC
数据手册DataSheet 下载
CYV15G0203TB:Independent Clock Dual HOTLink II™ Serializer(pdf, 815.4 KB)
数据手册更新日期：August 25, 2015
CYV15G0203TB-BGXC
| 8B / 10B ENDEC | 否 |
|---|---|
| 合格汽车 | 否 |
| Functions | Serializer |
| 最高工作温度 (°C) | 70 |
| 最高工作电压 (V) | 3.45 |
| Max. Speed (Mbps) | 1500 |
| 最低工作温度 (°C) | 0 |
| 最低工作电压 (V) | 3.15 |
| Min. Speed (Mbps) | 143 |
| No. of Channels | 2 |
| Standard | SMPTE / DVBASI |
封装与供应信息 Packaging/Ordering
| 工具包 | BGA |
|---|---|
| No. of Pins | 256 |
| Package Dimensions | 1 063 L x 1.6 H x 1 063 W (Mils) |
| Package Weight | 4 186.49 (mgs) |
| Package Cross Section Drawing | 下载 |
| Package Carrier | TRAY |
| Package Carrier Drawing / Orientation | , Drawing；Package Orientation |
| Standard Pack Quantity | 40 |
| Minimum Order Quantity (MOQ) | 40 |
| Order Increment | 40 |
| Estimated Lead Time (days) | 91 |
| HTS Code | 8542.39.0000 |
| ECCN | B.1 |
| ECCN Suball | 5A991 |
品质与环保 Quality and RoHS
| Moisture Sensitivity Level (MSL) | 3 |
|---|---|
| Peak Reflow Temp. (°C) | 260 () Cypress Reflow Profile |
| 符合有害物质限制 (RoHS) 标准 | Y Print RoHS Certificate of Compliance |
| 无铅 | 是 |
| Lead/Ball Finish | Sn/Ag/Cu |
| Marking | Cypress Marking Format |
封装材料声明
- 256-BGA 27X27MM PB-FREE PMDD Last Update: 2015 年 10 月 12 日
IPC 1752 材料成分声明
- IPC-1752-2_V1.1_256 - BGA ( 27 X 27 MM )_ASE Last Update: 2014 年 6 月 19 日
RoHS 分析证书 (CoA)
- PACKAGE ROHS ANALYSIS REPORT - BGA (BJ256) USING MOLD COMPOUND - FILL:CB0260-1 AND DAM :FP4451, ADHESIVE EN4900, SAC405 - ASE TAIWAN ASSEMBLY Last Update: 2012 年 7 月 04 日
应用笔记 (21)
| 文件标题 | 下载 |
| AN072 - Driving Teradyne FR4 and GETEK Backplanes with the Hotlink II Transceivers | |
| AN4047 - Crosstalk Analysis of the Quad Independent Channel HOTLink II™ Device | |
| AN1160 - Hotlink® CY7B923/CY7B933 to Hotlink II™ Migration |
|
| AN068 - Configuring the Independent ChannelHotlink II™ Device for Digital Video Transport | |
| AN5004 - HD-SDI and SD-SDI SMPTE Jitter Performance of the Independent Channel Hotlink II™ Transceiver in a System | |
| AN084 - SD-SDI and HD-SDI Checkfield Testing on Hotlink II™ Transceivers for SMPTE Pathological Conditions | |
| AN17006 - High Speed Serial Simulation with HOTLink II™ |
|
| AN1161 - HOTLink® Jitter Characteristics |
|
| AN1162 - HOTLink® Design Considerations |
|
| AN4059 - Clocking Options When Using HOTLink II™ Devices in HD-SDI Video Applications | |
| AN1055 - Termination and Biasing of HOTLink II™ High-Speed Serial I/O | |
| AN1027 - Using High-Speed Serial Links to Supplement Parallel Data Bus | |
| AN5076 - Guidelines for Selecting Reference Clock Input of the HOTLink II™ Device in Datacom Applications | |
| AN080 - Interfacing the Hotlink II™ Transceiver with the 3.3 V Gennum GS1524 Equalizer and GS1528 Cable Driver for Digital Video | |
| AN5073 - Guidelines for Selecting the Reference Clock Input of the HOTLink II™ Device in SMPTE SDI Video Applications | |
| AN060 - Frequently Asked Questions about the CYP(V)15G0403DXB Device | |
| AN5077 - Jitter Generation and Jitter Tolerance of Independent Channel HOTLink II™ Devices for Datacom Applications | |
| AN1184 - Frequently Asked Questions About HOTLink® |
|
| AN1025 - Using HOTLink® with Long Copper Cables |
|
| AN1032 - Using Decoupling Capacitors |
|
| AN027 - Power Consumption of HOTLink II™ Family of Devices |
|
开发套件/板 (2)
| 文件标题 | 下载 |
| CYV15G0404DX-VIDEO |
|
| CYV15G0404DX-EVAL |
|
软件与驱动程序 (1)
| 文件标题 | 下载 |
| SMPTE 259M Scrambler/Descrambler IP Core |
|
模型 (1)
| 文件标题 | 下载 |
| HOTLink II - IBIS |
|
产品变更通知 (PCN) (2)
| 文件标题 | 下载 |
| PCN050862 |
|
| PCN115094 |
|
Product Information Notice (PIN) (1)
| 文件标题 | 下载 |
| PIN145277 |
|
RoHS Analysis Certificates (CoA) for Direct Materials (1)
| 文件标题 | 下载 |
- Datasheet
- CYV15G0203TB Independent Clock Dual HOTLink II Serializer Datasheet.pdf English , 08/25/2015
- Download
- QTP 44507 256/304/504-Ball Plastic L2BGA Pb-Free, MSL3, 260C Reflow ASE Taiwan Assembly.pdf English , 08/07/2015
