FF1000R17IE4DP_B2

1700V PrimePACK™3 dual IGBT module with IGBT4, NTC and pre-applied Thermal Interface Material.

ParametricFF1000R17IE4DP_B2
ConfigurationDual
IC(nom) / IF(nom)1000.0A
VCE(sat) (Tvj=25°C typ)2.0V
VF (Tvj=25°C typ)1.7V
HousingPrimePACK™ 3
Sales Product NameFF1000R17IE4DP_B2
OPNFF1000R17IE4DPB2BOSA1
Product Statusactive and preferred
Package NameAG-PRIME3-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size3
Packing TypeTRAY
Summary of Features:
  • Extended Operation Temperature T(tvj op)
  • High DC Stability
  • High Current Density
  • Low Switching Losses
  • T(vj op) = 150°C
  • Low V(cesat)
  • Enlarged Diode for regenerative operation
  • Package with CTI > 400
  • High Creepage and Clearance Distances
  • High Power and Thermal Cycling Capability
  • Copper Base Plate
  • UL recognized
Benefits:
  • High Power Density
  • Standardized housing
Benefits:
  • High Power Density
  • Standardized housing
功能框图
Data Sheet
TitleSizeDateVersion
FF1000R17IE4DP_B2 (chinese/english),CN/EN,EN/DE,JA/EN874 KB04 四月 201602_00
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Application Notes
TitleSizeDateVersion
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Series connection of IGBTs；EN28 KB10 二月 2014
PrimePACK™ IGBT 模块 的适配器板；CN；EN1.6 MB25 十一月 2013
等效热路模型；CN；DE500 KB25 十一月 2013
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Paralleling of IGBTs；EN28 KB10 二月 2014
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
PrimePACK™ 模块的安装说明；CN；EN645 KB25 十一月 2013
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
Modules with pre-applied Thermal interface Material；EN393 KB26 一月 201601_01
Driving IGBTs with unipolar gate voltage；EN389 KB10 二月 2014
Product Brief
TitleSizeDateVersion
IHM, IHV Modules & PrimePACK™；EN452 KB27 四月 201608_00
Thermal Interface Material (TIM) - The only Infineon-qualified solution；EN410 KB27 四月 201604_00
Editorials
TitleSizeDateVersion
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
Properties of a New PrimePACK™ IGBT Module Concept；EN213 KB07 二月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Application Brochure
TitleSizeDateVersion
Solutions for Traction Systems；EN1.5 MB27 四月 201608_00
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 七月 2014
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Solutions for Wind Energy Systems；EN5.4 MB18 四月 2013
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - PP2 89x172 TIM；EN40 KB13 四月 201606_00
Evaluation Boards
BoardFamilyDescriptionStatus
MA300E17IGBT ModulesEvaluation Adapter board containing a booster stage for driving 1700V PrimePACK™ in single or parallel configuration. For connecting 1700V PrimePACK™ IGBT Modules and driver boardson request
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
CN/EN FF1000R17IE4DP_B2
EN/DE FF1000R17IE4DP_B2
JA/EN FF1000R17IE4DP_B2
EN 2EDN7524G
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN FF1400R17IP4
EN 2ED300E17-SFO
CN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN FF1400R17IP4
EN FF1400R17IP4
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
EN FF1400R17IP4P
EN IFS75B12N3E4_B32
EN MA401E17
EN FF1400R17IP4P
EN BYM600A170DN2
EN FF1400R17IP4
EN DD250S65K3
EN DD250S65K3
EN 2ED300C17-ST
EN XMC4500-E144X1024+AC
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FF650R17IE4DP_B2
EN IFS75B12N3E4_B32
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