FF1000R17IE4DP_B2

1700V PrimePACK™3 dual IGBT module with IGBT4, NTC and pre-applied Thermal Interface Material.

ParametricFF1000R17IE4DP_B2
ConfigurationDual
IC(nom) / IF(nom)1000.0A
VCE(sat) (Tvj=25°C typ)2.0V
VF (Tvj=25°C typ)1.7V
HousingPrimePACK™ 3
Sales Product NameFF1000R17IE4DP_B2
OPNFF1000R17IE4DPB2BOSA1
Product Statusactive and preferred
Package NameAG-PRIME3-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size3
Packing TypeTRAY
Summary of Features:
  • Extended Operation Temperature T(tvj op)
  • High DC Stability
  • High Current Density
  • Low Switching Losses
  • T(vj op) = 150°C
  • Low V(cesat)
  • Enlarged Diode for regenerative operation
  • Package with CTI > 400
  • High Creepage and Clearance Distances
  • High Power and Thermal Cycling Capability
  • Copper Base Plate
  • UL recognized
Benefits:
  • High Power Density
  • Standardized housing
Benefits:
  • High Power Density
  • Standardized housing
Diagrams
Data Sheet
TitleSizeDateVersion
FF1000R17IE4DP_B2 (german/english),EN/DE,CN/EN,JA/EN621 KB04 Apr 201602_00
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 Apr 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 Apr 201608_00
Application Notes
TitleSizeDateVersion
Paralleling of IGBTs；EN28 KB10 Feb 2014
Driving IGBTs with unipolar gate voltage；EN389 KB10 Feb 2014
Using the NTC inside a power module；EN；CN295 KB13 Jan 2010
Application Note IGBT Definition of Junction Temperature；EN84 KB09 Apr 2009
Thermische Ersatzschaltbilder；DE；CN300 KB20 Jun 2008
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 Dec 201501_02
Deadtime calculation for IGBT Modules；EN；CN308 KB06 Jun 2008
Assembly Instructions PrimePACK™ Modules；EN；CN2.3 MB27 Mar 201402_00
Module Adapter Board for PrimePACK™；EN；CN1.1 MB14 Dec 2010
Series connection of IGBTs；EN28 KB10 Feb 2014
Modules with pre-applied Thermal interface Material；EN393 KB26 Jan 201601_01
Product Brief
TitleSizeDateVersion
Thermal Interface Material (TIM) - The only Infineon-qualified solution；EN410 KB27 Apr 201604_00
IHM, IHV Modules & PrimePACK™；EN452 KB27 Apr 201608_00
Editorials
TitleSizeDateVersion
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 May 2014
Properties of a New PrimePACK™ IGBT Module Concept；EN213 KB07 Feb 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 Nov 201501_00
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 May 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 Apr 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 Apr 201608_00
Solutions for Wind Energy Systems；EN5.4 MB18 Apr 2013
Solutions for Traction Systems；EN1.5 MB27 Apr 201608_00
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 Jul 2014
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 May 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - PP2 89x172 TIM；EN40 KB13 Apr 201606_00
Evaluation Boards
BoardFamilyDescriptionStatus
MA300E17IGBT ModulesEvaluation Adapter board containing a booster stage for driving 1700V PrimePACK™ in single or parallel configuration. For connecting 1700V PrimePACK™ IGBT Modules and driver boardson request
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 Mar 2014
CN/EN FF1000R17IE4DP_B2
EN/DE FF1000R17IE4DP_B2
JA/EN FF1000R17IE4DP_B2
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