ISL6208: High Voltage Synchronous Rectified Buck MOSFET Drivers

The ISL6208 and ISL6208B are high frequency, dual MOSFET drivers, optimized to drive two N-Channel power MOSFETs in a synchronous-rectified buck converter topology. They are especially suited for mobile computing applications that require high efficiency and excellent thermal performance. These drivers, combined with an Intersil multiphase Buck PWM controller, form a complete single-stage core-voltage regulator solution for advanced mobile microprocessors.

ISL6208 and ISL6208B have the same function but different packages. The descriptions in this datasheet are based on ISL6208 and also apply to ISL6208B.

The ISL6208 features 4A typical sinking current for the lower gate driver. This current is capable of holding the lower MOSFET gate off during the rising edge of the Phase node. This prevents shoot-through power loss caused by the high dv/dt of phase voltages. The operating voltage matches the 30V breakdown voltage of the MOSFETs commonly used in mobile computer power supplies.

The ISL6208 also features a three-state PWM input that, working together with Intersil’s multiphase PWM controllers, will prevent negative voltage output during CPU shutdown. This feature eliminates a protective Schottky diode usually seen in a microprocessor power systems.

MOSFET gates can be efficiently switched up to 2MHz using the ISL6208. Each driver is capable of driving a 3000pF load with propagation delays of 8ns and transition times under 10ns. Bootstrapping is implemented with an internal Schottky diode. This reduces system cost and complexity, while allowing the use of higher performance MOSFETs. Adaptive shoot-through protection is integrated to prevent both MOSFETs from conducting simultaneously.

A diode emulation feature is integrated in the ISL6208 to enhance converter efficiency at light load conditions. This feature also allows for monotonic start-up into pre-biased outputs. When diode emulation is enabled, the driver will allow discontinuous conduction mode by detecting when the inductor current reaches zero and subsequently turning off the low side MOSFET gate.

Key Features
  • Dual MOSFET drives for synchronous rectified bridge
  • Adaptive shoot-through protection
  • 0.5Ω On-resistance and 4A sink current capability
  • Supports high switching frequency up to 2MHz
    • Fast output rise and fall time
    • Low propagation delay
  • Three-state PWM input for power stage shutdown
  • Internal bootstrap Schottky diode
  • Low bias supply current (5V, 80µA)
  • Diode emulation for enhanced light load efficiency and pre-biased start-up applications
  • VCC POR (Power-On-Reset) feature integrated
  • Low three-state shutdown holdoff time (typical 160ns)
  • Pin-to-pin compatible with ISL6207
  • QFN and DFN package:
    • Compliant to JEDEC PUB95 MO-220QFN - Quad flat no leads - package outlineDFN - Dual flat no leads - package outline
    • Near chip scale package footprint, which improves PCB efficiency and has a thinner profile
  • Pb-free (RoHS Compliant)
Applications
  • Core voltage supplies for Intel® and AMD® mobile microprocessors
  • High frequency low profile DC/DC converters
  • High current low output voltage DC/DC converters
  • High input voltage DC/DC converters
Typical Diagram
Application Notes
TitleTypeUpdatedSizeOther Languages
AN1116: Elantec CMOS applicationsPDF13 Nov 2014231 KB
Datasheets
TitleTypeUpdatedSizeOther Languages
ISL6208, ISL6208B DatasheetPDF17 Nov 20141.1 MB
Tech Briefs
TitleTypeUpdatedSizeOther Languages
TB363: Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)PDF13 Jan 201529 KB
TB458: Converting a Fixed PWM to an Adjustable PWMPDF19 Nov 2014147 KB
TB447: Guidelines for Preventing Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICsPDF19 Nov 2014137 KB
TB389: PCB Land Pattern and Surface Mount Guidelines for QFN PackagesPDF19 Nov 2014661 KB
White Papers
TitleTypeUpdatedSizeOther Languages
Five Easy Steps to Create a Multi-Load Power SolutionPDF30 Jan 2017502 KB
Order Information
Part NumberPackage TypeWeight(g)PinsMSL RatingPeak Temp (°C)RoHS Status
ISL6208CB8 Ld SOIC0.07281240
ISL6208CB-T8 Ld SOIC T+R0.07281240
ISL6208CBZ8 Ld SOIC0.07283260RoHS
ISL6208CBZ-T8 Ld SOIC T+R0.07283260RoHS
ISL6208CBZA8 Ld SOIC0.0728260RoHS
ISL6208CBZA-T8 Ld SOIC T+R0.0728260RoHS
ISL6208CR8 Ld QFN0.02281240
ISL6208CR-T8 Ld QFN T+R0.02281240
ISL6208CRZ8 Ld QFN0.02281260RoHS
ISL6208CRZ-T8 Ld QFN T+R0.02281260RoHS
ISL6208CRZA8 Ld QFN0.0228260RoHS
ISL6208CRZA-T8 Ld QFN T+R0.0228260RoHS
ISL6208IB8 Ld SOIC0.07281240
ISL6208IB-T8 Ld SOIC T+R0.07281240
ISL6208IBZ8 Ld SOIC0.07283260RoHS
ISL6208IBZ-T8 Ld SOIC T+R0.07283260RoHS
ISL6208IR8 Ld QFN0.0228240
ISL6208IR-T8 Ld QFN T+R0.0228240
ISL6208IRZ8 Ld QFN0.02282260RoHS
ISL6208IRZ-T8 Ld QFN T+R0.02282260RoHS
ISL6208, ISL6208B Datasheet 17 Nov 2014
8 Ld SOIC T+R ISL84514
8 Ld QFN T+R ISL6605
ISL6208B
AN1116: Elantec CMOS applications 13 Nov 2014
TB363: Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) 13 Jan 2015
TB458: Converting a Fixed PWM to an Adjustable PWM 19 Nov 2014
TB447: Guidelines for Preventing Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICs 19 Nov 2014
TB389: PCB Land Pattern and Surface Mount Guidelines for QFN Packages 19 Nov 2014
Five Easy Steps to Create a Multi-Load Power Solution 30 Jan 2017