2PA1774M series: PNP通用晶体管
PNP通用晶体管，采用SOT883无引脚超小型塑料封装。
NPN补充产品：2PC4617M系列。
SOT883
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| PNP general purpose transistor (REV 1.0) PDF (129.0 kB) 2PA1774M_SERIES [English] | 19 Feb 2004 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English] | 22 Jul 2016 |
可靠性与质量信息 (6)
| 名称/描述 | Modified Date |
|---|---|
| 2PA1774QM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774QM [English] | 31 Jan 2015 |
| 2PA1774QM NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774QM_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| 2PA1774RM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774RM [English] | 31 Jan 2015 |
| 2PA1774RM NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774RM_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| 2PA1774SM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774SM [English] | 31 Jan 2015 |
| 2PA1774SM NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774SM_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- 2PA1774QM SPICE model (REV 1.4) prm 2PA1774QM_1 7/22/2012
- 2PA1774RM SPICE model (REV 1.4) prm 2PA1774RM_1 7/22/2012
- 2PA1774SM SPICE model (REV 1.4) prm 2PA1774SM_1 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| 2PA1774SM | Active |
| 2PA1774RM | Active |
| 2PA1774QM | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2PA1774SM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774SM,315 (9340 571 44315) | PC | 2PA1774SM |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| 2PA1774RM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774RM,315 (9340 571 42315) | PA | 2PA1774RM | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| 2PA1774QM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774QM,315 (9340 571 43315) | PB | 2PA1774QM | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- PNP general purpose transistor 2PA1774SM
- 2PA1774QM NXP® Product Reliability 2PA1774QM
- 2PA1774QM NXP Product Quality 2PA1774QM
- 2PA1774RM NXP® Product Reliability 2PA1774RM
- 2PA1774RM NXP Product Quality 2PA1774RM
- 2PA1774SM NXP® Product Reliability 2PA1774SM
- 2PA1774SM NXP Product Quality 2PA1774SM
- 2PA1774QM SPICE model 2PA1774QM
- 2PA1774RM SPICE model 2PA1774RM
- 2PA1774SM SPICE model 2PA1774SM
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- PMZ950UPE
