2PA1774M series: PNP general purpose transistor
PNP general purpose transistor in a SOT883 leadless ultra small plastic package.
NPN complement: 2PC4617M series.
SOT883
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| PNP general purpose transistor (REV 1.0) PDF (129.0 kB) 2PA1774M_SERIES [English] | 19 Feb 2004 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English] | 22 Jul 2016 |
Reliability and Quality Information (6)
| Name/Description | Modified Date |
|---|---|
| 2PA1774QM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774QM [English] | 31 Jan 2015 |
| 2PA1774QM NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774QM_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| 2PA1774RM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774RM [English] | 31 Jan 2015 |
| 2PA1774RM NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774RM_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| 2PA1774SM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774SM [English] | 31 Jan 2015 |
| 2PA1774SM NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774SM_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- 2PA1774QM SPICE model (REV 1.4) prm 2PA1774QM_1 7/22/2012
- 2PA1774RM SPICE model (REV 1.4) prm 2PA1774RM_1 7/22/2012
- 2PA1774SM SPICE model (REV 1.4) prm 2PA1774SM_1 7/22/2012
Ordering Information
| Product | Status |
|---|---|
| 2PA1774SM | Active |
| 2PA1774RM | Active |
| 2PA1774QM | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2PA1774SM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774SM,315 (9340 571 44315) | PC | 2PA1774SM |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| 2PA1774RM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774RM,315 (9340 571 42315) | PA | 2PA1774RM | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| 2PA1774QM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774QM,315 (9340 571 43315) | PB | 2PA1774QM | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- PNP general purpose transistor 2PA1774SM
- 2PA1774QM NXP® Product Reliability 2PA1774QM
- 2PA1774QM NXP Product Quality 2PA1774QM
- 2PA1774RM NXP® Product Reliability 2PA1774RM
- 2PA1774RM NXP Product Quality 2PA1774RM
- 2PA1774SM NXP® Product Reliability 2PA1774SM
- 2PA1774SM NXP Product Quality 2PA1774SM
- 2PA1774QM SPICE model 2PA1774QM
- 2PA1774RM SPICE model 2PA1774RM
- 2PA1774SM SPICE model 2PA1774SM
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
- PMZ950UPE
