NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.
名称/描述 | Modified Date |
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45V/60V/80V, 1A NPN medium power transistors (REV 1.0) PDF (893.0 kB) BC54_55_56PAS_SER [English] | 11 Nov 2014 |
名称/描述 | Modified Date |
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Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
名称/描述 | Modified Date |
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DFN2020D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (192.0 kB) SOT1061D [English] | 08 Feb 2016 |
名称/描述 | Modified Date |
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BC55-10PAS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55-10PAS [English] | 31 Jan 2015 |
BC55-10PAS NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55-10PAS_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
型号 | 状态 | Package version | Package name | 大小 (mm) | Complement | Ptot (mW) | IC [max] (mA) | Polarity | IC max (mA) | Ptot [max] (mW) | hFE max | VCEO [max] (V) | fT [min] (MHz) | hFE [max] | hFE [min] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BC55-10PAS | Active | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | BC52-10PAS | 1000 | NPN | 1650 | 60 | 180 | 160 | 63 |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF(小时) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BC55-10PAS | SOT1061D | Reel 7" Q1/T1 | Active | BC55-10PASX (9340 681 28115) | CH | BC55-10PAS | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |