NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.
Name/Description | Modified Date |
---|---|
45V/60V/80V, 1A NPN medium power transistors (REV 1.0) PDF (893.0 kB) BC54_55_56PAS_SER | 11 Nov 2014 |
Name/Description | Modified Date |
---|---|
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 | 26 May 2015 |
Name/Description | Modified Date |
---|---|
DFN2020D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (192.0 kB) SOT1061D | 08 Feb 2016 |
Name/Description | Modified Date |
---|---|
BC55-10PAS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC55-10PAS | 31 Jan 2015 |
BC55-10PAS NXP Product Quality (REV 1.2) PDF (74.0 kB) BC55-10PAS_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | IC [max] (mA) | IC max (mA) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | hFE [min] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BC55-10PAS | Active | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | BC52-10PAS | 1000 | NPN | 1650 | 60 | 180 | 160 | 63 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BC55-10PAS | SOT1061D | Reel 7" Q1/T1 | Active | BC55-10PASX (9340 681 28115) | CH | BC55-10PAS | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |