NUP1301U: 超低电容ESD保护阵列

超低电容静电放电(ESD)保护阵列采用小型SOT323 (SC-70)表面贴装设备(SMD)塑料封装,保护轨到轨配置中的单条信号线,使其免受ESD和其他瞬态电压导致的损坏。

SOT323
数据手册 (1)
名称/描述Modified Date
Ultra low capacitance ESD protection array (REV 1.0) PDF (142.0 kB) NUP1301U [English]28 Jan 2011
手册 (1)
名称/描述Modified Date
Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664 [English]03 Jul 2015
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
NUP1301U NXP Product Quality (REV 1.2) PDF (74.0 kB) NUP1301U_NXP_PRODUCT_QUALITY [English]31 Jan 2015
NUP1301U NXP® Product Reliability (REV 1.1) PDF (82.0 kB) NUP1301U_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
NUP1301UActiveSOT323SC-702 x 1.25 x 0.951Unidirectional0.60.7580300.1
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
NUP1301USOT323Reflow_Soldering_ProfileReel 7" Q1/T1ActiveNUP1301U,115 (9340 653 89115)%VUNUP1301UAlways Pb-free347.01.616.21E811
Ultra low capacitance ESD protection array NUP1301U
Application guide: ESD protection prtr5v0u2x
NUP1301U NXP Product Quality NUP1301U
NUP1301U NXP® Product Reliability NUP1301U
NUP1301U SPICE model NUP1301U
plastic surface-mounted package; 3 leads BSS84AKW
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKW
PRF947