Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package designed to protect one signal line in rail-to-rail configuration from the damage caused by ESD and other transients.
Name/Description | Modified Date |
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Ultra low capacitance ESD protection array (REV 1.0) PDF (142.0 kB) NUP1301U | 28 Jan 2011 |
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Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664 | 03 Jul 2015 |
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plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 | 16 Nov 2012 |
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NUP1301U NXP Product Quality (REV 1.2) PDF (74.0 kB) NUP1301U_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
NUP1301U NXP® Product Reliability (REV 1.1) PDF (82.0 kB) NUP1301U_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
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NUP1301U | Active | SOT323 | SC-70 | 2 x 1.25 x 0.95 | 1 | Unidirectional | 0.6 | 0.75 | 80 | 30 | 0.1 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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NUP1301U | SOT323 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | NUP1301U,115 (9340 653 89115) | %VU | NUP1301U | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |