PCF8576C是一款外围器件,能驱动几乎任何低复用率液晶显示器(LCD)。可为任何包含最多4背板和40分段且可方便级联进行更大LCD应用的静态或多路复用LCD生成驱动信号。PCF8576C兼容大多数微处理器或微控制器并通过两线双向I²C总线进行通信。通过带有自动递增寻址的显示RAM和硬件从地址寻址使通信开销最小化。
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Universal LCD driver for low multiplex rates (REV 13.0) PDF (496.0 kB) PCF8576C [English] | 16 Dec 2013 |
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EMC and system level ESD design guidelines for LCD drivers (REV 1.0) PDF (910.0 kB) AN11267 [English] | 06 Mar 2015 |
Cascading NXP® LCD segment drivers (REV 1.0) PDF (766.0 kB) AN11494 [English] | 06 Mar 2015 |
Design guidelines for COG modules with NXP® monochrome LCD drivers (REV 4.0) PDF (205.0 kB) AN10170 [English] | 04 Aug 2014 |
ESD and EMC sensitivity of IC (REV 1.0) PDF (745.0 kB) AN10853 [English] | 14 Mar 2013 |
Handling bare die (REV 2.0) PDF (1.6 MB) AN10706 [English] | 16 Jun 2011 |
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Store and transport requirements (REV 3.0) PDF (325.0 kB) UM10569 [English] | 10 Mar 2015 |
I2C-bus specification and user manual (REV 6.0) PDF (1.4 MB) UM10204 [English] | 28 Apr 2014 |
I2C-bus specification and user manual (REV 5.0) PDF (1.6 MB) UM10204_JA [English] | 03 Apr 2013 |
I2C Demonstration Board 2005-1 Quick Start Guide (REV 1.0) PDF (261.0 kB) UM10206 [English] | 13 Jun 2006 |
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NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns (REV 1.0) PDF (3.5 MB) 75017540 [English] | 01 Aug 2014 |
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Chip-On-Glass (COG) - a cost-effective and reliable technology for LCD displays (REV 2.0) PDF (1.2 MB) R_10015_1 [English] | 12 Apr 2016 |
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Wire bond die; 56 bonding pads (REV 1.0) PDF (161.0 kB) OL-PCF8576CU [English] | 10 Feb 2016 |
plastic very small outline package; 56 leads (REV 1.0) PDF (519.0 kB) SOT190-1 [English] | 08 Feb 2016 |
plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm (REV 1.0) PDF (537.0 kB) SOT314-2 [English] | 08 Feb 2016 |
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VSO56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (195.0 kB) SOT190-1_118 [English] | 15 Apr 2013 |
LQFP64; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (239.0 kB) SOT314-2_118 [English] | 15 Apr 2013 |
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Footprint for wave soldering (REV 1.0) PDF (11.0 kB) HTQFP-HLQFP-LQFP-MSQFP-WAVE [English] | 08 Oct 2009 |
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English] | 08 Oct 2009 |
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产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | IFR(FIT) | MTBF(小时) | MSL | MSL LF |
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PCF8576CHL/1 | SOT314-2 | HTQFP-HLQFP-LQFP-MSQFP-WAVE | Reel 13" Q1/T1 | Active | PCF8576CHL/1,118 (9352 903 05118) | PCF8576CHL | PCF8576CHL/1 | Always Pb-free | 5 | 2E8 | 1 | 1 | ||
Tray, Bakeable, Multiple | Discontinued | PCF8576CHL/1,157 (9352 903 05157) | PCF8576CHL | PCF8576CHL/1 | Always Pb-free | 5 | 2E8 | 1 | 1 | |||||
PCF8576CU/2/F2 | OL-PCF8576CU | Die In Waffle Carriers 2" | Active | PCF8576CU/2/F2,026 (9352 618 51026) | Standard Marking | PCF8576CU/2/F2 | Always Pb-free | 5 | 2E8 | NA | NA | |||
PCF8576CU/F1 | OL-PCF8576CU | Die In Waffle Carriers 2" | Active | PCF8576CU/F1,026 (9352 086 00026) | Standard Marking | PCF8576CU/F1 | Always Pb-free | 5 | 2E8 | NA | NA | |||
PCF8576CT/S480/1 | SOT190-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 | Active | PCF8576CT/S480/1,1 (9352 617 21118) | PCF8576CT/S480 | PCF8576CT/S480/1 | week 23, 2006 | 5 | 2E8 | 1 | NA | ||
PCF8576CT/1 | SOT190-1 | SSOP-TSSOP-VSO-WAVE | Reel 13" Q1/T1 in Drypack | Active | PCF8576CT/1,518 (9352 788 18518) | PCF8576CT | PCF8576CT/1 | week 45, 2013 | 5 | 2E8 | 3 | 3 | ||
Reel 13" Q1/T1 | Withdrawn | PCF8576CT/1,118 (9352 788 18118) | PCF8576CT | PCF8576CT/1 | Always Pb-free | 5 | 2E8 | 1 | 1 |