PCF8576C: Universal LCD driver for low multiplex rates

The PCF8576C is a peripheral device which interfaces to almost any Liquid Crystal Display (LCD) with low multiplex rates. It generates the drive signals for any static or multiplexed LCD containing up to four backplanes and up to 40 segments and can easily be cascaded for larger LCD applications. The PCF8576C is compatible with most microprocessors or microcontrollers and communicates via a two-line bidirectional I²C-bus. Communication overheads are minimized by a display RAM with auto-incremented addressing and by hardware subaddressing.

PCF8576C: Product Block Diagram
Outline 3d SOT314-2
Data Sheets (1)
Name/DescriptionModified Date
Universal LCD driver for low multiplex rates (REV 13.0) PDF (496.0 kB) PCF8576C16 Dec 2013
Application Notes (5)
Name/DescriptionModified Date
EMC and system level ESD design guidelines for LCD drivers (REV 1.0) PDF (910.0 kB) AN1126706 Mar 2015
Cascading NXP® LCD segment drivers (REV 1.0) PDF (766.0 kB) AN1149406 Mar 2015
Design guidelines for COG modules with NXP® monochrome LCD drivers (REV 4.0) PDF (205.0 kB) AN1017004 Aug 2014
ESD and EMC sensitivity of IC (REV 1.0) PDF (745.0 kB) AN1085314 Mar 2013
Handling bare die (REV 2.0) PDF (1.6 MB) AN1070616 Jun 2011
Users Guides (4)
Name/DescriptionModified Date
Store and transport requirements (REV 3.0) PDF (325.0 kB) UM1056910 Mar 2015
I2C-bus specification and user manual (REV 6.0) PDF (1.4 MB) UM1020428 Apr 2014
I2C-bus specification and user manual (REV 5.0) PDF (1.6 MB) UM10204_JA03 Apr 2013
I2C Demonstration Board 2005-1 Quick Start Guide (REV 1.0) PDF (261.0 kB) UM1020613 Jun 2006
Brochures (1)
Name/DescriptionModified Date
NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns (REV 1.0) PDF (3.5 MB) 7501754001 Aug 2014
White Papers (1)
Name/DescriptionModified Date
Chip-On-Glass (COG) - a cost-effective and reliable technology for LCD displays (REV 2.0) PDF (1.2 MB) R_10015_112 Apr 2016
Package Information (3)
Name/DescriptionModified Date
Wire bond die; 56 bonding pads (REV 1.0) PDF (161.0 kB) OL-PCF8576CU10 Feb 2016
plastic very small outline package; 56 leads (REV 1.0) PDF (519.0 kB) SOT190-108 Feb 2016
plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm (REV 1.0) PDF (537.0 kB) SOT314-208 Feb 2016
Packing (2)
Name/DescriptionModified Date
VSO56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (195.0 kB) SOT190-1_11815 Apr 2013
LQFP64; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (239.0 kB) SOT314-2_11815 Apr 2013
Supporting Information (2)
Name/DescriptionModified Date
Footprint for wave soldering (REV 1.0) PDF (11.0 kB) HTQFP-HLQFP-LQFP-MSQFP-WAVE08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE08 Oct 2009
Ordering Information
Product
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateIFR(FIT)MTBF(hour)MSLMSL LF
PCF8576CHL/1SOT314-2HTQFP-HLQFP-LQFP-MSQFP-WAVEReel 13" Q1/T1ActivePCF8576CHL/1,118 (9352 903 05118)PCF8576CHLPCF8576CHL/1Always Pb-free52E811
Tray, Bakeable, MultipleDiscontinuedPCF8576CHL/1,157 (9352 903 05157)PCF8576CHLPCF8576CHL/1Always Pb-free52E811
PCF8576CU/2/F2OL-PCF8576CUDie In Waffle Carriers 2"ActivePCF8576CU/2/F2,026 (9352 618 51026)Standard MarkingPCF8576CU/2/F2Always Pb-free52E8NANA
PCF8576CU/F1OL-PCF8576CUDie In Waffle Carriers 2"ActivePCF8576CU/F1,026 (9352 086 00026)Standard MarkingPCF8576CU/F1Always Pb-free52E8NANA
PCF8576CT/S480/1SOT190-1SSOP-TSSOP-VSO-WAVEReel 13" Q1/T1ActivePCF8576CT/S480/1,1 (9352 617 21118)PCF8576CT/S480PCF8576CT/S480/1week 23, 200652E81NA
PCF8576CT/1SOT190-1SSOP-TSSOP-VSO-WAVEReel 13" Q1/T1 in DrypackActivePCF8576CT/1,518 (9352 788 18518)PCF8576CTPCF8576CT/1week 45, 201352E833
Reel 13" Q1/T1WithdrawnPCF8576CT/1,118 (9352 788 18118)PCF8576CTPCF8576CT/1Always Pb-free52E811
Universal LCD driver for low multiplex rates PCF8576C
EMC and system level ESD design guidelines for LCD drivers pcf8576d_automotive
Cascading NXP® LCD segment drivers pcf8576d_automotive
Design guidelines for COG modules with NXP® monochrome LCD drivers pcf8576d_automotive
ESD and EMC sensitivity of IC pcf8576d_automotive
Handling bare die pcf8576d_automotive
Store and transport requirements pcf8576d_automotive
I2C-bus specification and user manual pca9685pw
I2C-bus specification and user manual pca9685pw
I2C Demonstration Board 2005-1 Quick Start Guide pca9685pw
NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns pca9685pw
Chip-On-Glass (COG) - a cost-effective and reliable technology for LCD displays pcf8576d_automotive
SOT314-2 LPC54114J256BD64
HTQFP-HLQFP-LQFP-MSQFP-WAVE LPC54114J256BD64
Reel 13" Q1/T1 LPC11U37FBD64
Wire bond die; 56 bonding pads PCF8576C
plastic very small outline package; 56 leads pca8576c_automotive
SSOP-TSSOP-VSO-WAVE LPC1114FDH28
VSO56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... pca8576c_automotive
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