BAT54CM: 双倍肖特基势垒二极管

双倍平面肖特基势垒二极管采用SOT883超小型无引脚塑料封装。

BAT54CM: 产品结构框图
SOT883
数据手册 (1)
名称/描述Modified Date
Schottky barrier double diode (REV 1.1) PDF (178.0 kB) BAT54CM [English]11 Nov 2009
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English]22 Jul 2016
可靠性与质量信息 (2)
名称/描述Modified Date
BAT54CM NXP Product Quality (REV 1.2) PDF (74.0 kB) BAT54CM_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BAT54CM NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BAT54CM_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)IR [max] (µA)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)VR [max] (V)IF [max] (mA)VR (V)
BAT54CMActiveSOT883DFN1006-31.0 x 0.6 x 0.52dual c.c.8000.61030200
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BAT54CMSOT883Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActiveBAT54CM,315 (9340 572 52315)S3BAT54CMAlways Pb-free157.00.731.37E911
Schottky barrier double diode BAT54CM
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
BAT54CM NXP Product Quality BAT54CM
BAT54CM NXP® Product Reliability BAT54CM
BAT54CM SPICE model BAT54CM
DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
BAT54CM
PMZ950UPE