The ST33GxxxM are serial access microcontrollers designed for machine-to-machine (M2M) applications in the industrial environment. They incorporate the most recent generation of ARM® processors for embedded secure systems. Their SecurCore® SC300™ 32-bit RISC core is built on the Cortex® M3 core with additional security features to help to protect against advanced forms of attacks.
Cadenced at 25 MHz, the SC300™ core brings great performance and excellent code density thanks to the Thumb®-2 instruction set.
The high-speed embedded Flash memory introduces more flexibility to the system.
The ST33GxxxM also offers a serial communication interface fully compatible with the ISO/IEC 7816-3 standard (T=0, T=1) and a single-wire protocol (SWP) interface for communication with a near field communication (NFC) router in SIM/NFC applications.
An SPI Master/Slave interface is also available for communication in non-SIM applications.
Three general purpose 16-bit timers are available; one is configurable as a watchdog.
The ST33GxxxM features hardware accelerators for advanced cryptographic functions. The EDES peripheral provides a secure DES (Data Encryption Standard) algorithm implementation, while the NESCRYPT cryptoprocessor efficiently supports the public key algorithm. The AES peripheral ensures secure and fast AES algorithm implementation.
The device operates in the –40 to +105 °C temperature range and 1.8 V, 3 V and 5 V supply voltage ranges. A comprehensive range of power-saving modes enables the design of efficient low-power applications.
The ST33GxxxM is delivered in wafer form and in ECOPACK®-compliant DFN8 packages.
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®packages, depending on their level of environmental compliance. ECOPACK®specifications, grade definitions and product status are available at: www.st.com. ECOPACK®is an ST trademark.
Key Features
Description | Version | Size |
---|---|---|
DB2807: M2M industrial secure MCU with 32-bit ARM® SecurCore® SC300™ CPU and high-density Flash memory | 2.0 | 203 KB |
Description | Version | Size |
---|---|---|
Brochure Secure MCUs - M2M for industrial and automotive | 1 MB | |
Brochure_Secure MCUs_Secure Soluions_RS6103_BRSMCU0616.pdf | 1 MB |
型号 | Unit Price (US$) * | Quantity | Package | ECCN (EU) | ECCN (US) | Country of Origin |
---|---|---|---|---|---|---|
ST33G384M | - | - | DICE | NEC | EAR99 | - |
型号 | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|
ST33G384M | DICE | Industrial | N/A |