DCPL-WB-02D3:Wide-band, dual-path directional coupler with integrated 50 ohm loaded isolated port

The DCPL-WB-02D3 is a wide-band, dual-path directional coupler designed to measure transmission output power in WLAN applications. This dual path CPL has been customized for wide-band operating frequencies (2G/5G WLAN) with low insertion losses in the transmission bandwidth (2400 MHz - 5850 MHz).

This device is built with two different RF couplers (one dedicated to LB, the other dedicated to HB) sharing the same coupled ports. Isolated port is loaded with an integrated 50 Ω resistor.

The DCPL-WB-02D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel.

Key Features

  • 50 Ω nominal input / output impedance
  • Wide operating frequency range:
    • 2400 MHz-5850 MHz
  • Low insertion loss
  • High ESD ruggedness
  • Lead-free CSP
  • Small footprint: 1670 x 1440 μm
  • Very low profile (< 600 μm after reflow)
  • Benefits
    • High RF performance
    • RF module size reduction
产品规格
DescriptionVersionSize
DS9086: Wide-band, dual-path directional coupler with integrated 50 ohm loaded isolated port1.093 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
样片和购买
型号PackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
DCPL-WB-02D3Chip Scale Package 0.4mm pitchTape And Reel50000.224100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
DCPL-WB-02D3Chip Scale Package 0.4mm pitchIndustrialEcopack2
Wide-band, dual-path directional coupler with integrated 50 ohm loaded isolated port DCPL-WB-02D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21