EMIF07-LCD02F3:7-line EMI filter ans ESD protection for display interfaces

The EMIF07-LCD02F3 is a 7-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF07 Flip Chip package means the package size is equal to the die size.

This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15 kV.

Key Features

  • High reliability offered by monolithic integration
  • High efficiency in ESD suppression
  • Complies with the following standardsIEC 61000-4-2 level 4 on inputs and outputs: 15 kV (air discharge) 8 kV (contact discharge)MIL STD 883G - Method 3015-7 Class 3
  • EMI symmetrical (I/O) low-pass filter
  • Lead-free package
  • High efficiency in EMI filtering
  • Very thin package: 0.65 mm
  • High reduction of parasitic elements through integration and wafer level packaging
  • Very low PCB space occupation: 1.94 mm x 1.54 mm
产品规格
DescriptionVersionSize
DS4410: 7-line IPAD™, EMI filter and ESD protection for LCD and cameras3.1265 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
AN3141: LC filters for mobile phone LCD and camera links1.1338 KB
Technical Notes & Articles
DescriptionVersionSize
TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets1.2115 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
HW Model & CAD Libraries
DescriptionVersionSize
EMIF07-LCD02F3 S-parameter model (.sxp)411 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF07-LCD02F3Chip Scale Package 0.4mm pitchTape And Reel0.4871000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF07-LCD02F3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_g0-wspc-csps0.4_kdg0emif7lk-wspc-(emif07-lcd02f3).pdf
md_g0-wspc-csps0.xml
7-line IPAD™, EMI filter and ESD protection for LCD and cameras EMIF07-LCD02F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
LC filters for mobile phone LCD and camera links EMIF08-LCD04M16
EMI and ESD consideration for LCD and cameras in wireless handsets EMIF08-1005M16
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF07-LCD02F3
md_g0-wspc-csps0.4_kdg0emif7lk-wspc-(emif07-lcd02f3).pdf EMIF07-LCD02F3
md_g0-wspc-csps0.xml EMIF07-LCD02F3