LSM6DS3H：iNEMO inertial module: 3D accelerometer and 3D gyroscope

The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.

The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I²C/SPI).

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DS3H is available in a plastic land grid array (LGA) package.

Key Features

Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
“Always-on” experience with low power consumption for both accelerometer and gyroscope
Interface flexibility: selectable SPI (3/4-wire) or I2 C with the main processor
Auxiliary SPI (3-wire) to support OIS applications
EIS/OIS support
Accelerometer ODR up to 6.66 kHz
Gyroscope ODR up to 3.33 kHz
Smart FIFO
±2/±4/±8/±16 g full scale
±125/±245/±500/±1000/±2000 dps full scale
Analog supply voltage: 1.71 V to 3.6 V
Independent IOs supply (1.62 V)
Compact footprint, 2.5 mm x 3 mm x 0.83 mm
SPI/I2 C serial interface data synchronization feature
Embedded temperature sensor
ECOPACK® , RoHS and “Green” compliant

产品规格

Description	Version	Size
DS11273: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope	4.0	1 MB

应用手册

Description	Version	Size
AN4844: LSM6DS3H: always-on 3D accelerometer and 3D gyroscope	3.0	2 MB

Technical Notes & Articles

Description	Version	Size
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package	5.0	218 KB

Design Notes & Tips

Description	Version	Size
DT0060: Exploiting the gyroscope to update tilt measure and e-compass	1.0	226 KB
DT0047: How to install and run the osxMotionAR Activity Recognition library	1.1	273 KB
DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance	1.0	616 KB

手册

Description	Version	Size
MEMS and Sensors, Smart solutions for IoT and enhanced user experience		1 MB

白皮书

Description	Version	Size
Optical Image Stabilization (OIS) - white paper	1.0	3 MB

Product Evaluation Tools

型号	制造商	Description
STEVAL-MKI176V1	ST	LSM6DS3H adapter board for standard DIL24 socket

样片和购买

型号	Package	Packing Type	Unit Price (US$) *	Quantity	ECCN (EU)	ECCN (US)	Country of Origin
LSM6DS3H	VFLGA 2.5X3X0.86 14L	Tray	-	1000	NEC	EAR99	-
LSM6DS3HTR	VFLGA 2.5X3X0.86 14L	Tape And Reel	2.093	1000	NEC	EAR99	-

质量和可靠性

型号	Package	Grade	RoHS Compliance Grade	Material Declaration**
LSM6DS3H	VFLGA 2.5X3X0.86 14L	Industrial	Ecopack2	md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.pdf md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.xml
LSM6DS3HTR	VFLGA 2.5X3X0.86 14L	Industrial	Ecopack2	md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.pdf md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.xml