ADL5530 DC to 1000 MHz IF Gain Block

The ADL5530 is a broadband, fixed-gain, linear amplifier that operates at frequencies up to 1000 MHz. The device can be used in a wide variety of wired and wireless devices, including cellular, broadband, CATV, and LMDS/MMDS applications.

The ADL5530 provides a gain of 16.5 dB, which is stable over frequency, temperature, power supply, and from device to device. It achieves an OIP3 of 37 dBm with an output compression point of 21.8 dB and a noise figure of 3 dB.

This amplifier is single-ended and internally matched to 50 Ω with an input return loss of 11 dB. Only input/output ac-coupling capacitors, a power supply decoupling capacitor, and an external inductor are required for operation.

The ADL5530 operates with supply voltages of 3 V or 5 V with a supply current of 110 mA.

The ADL5530 is fabricated on a GaAs pHEMPT process. The device is packaged in a 3 mm × 2 mm LFCSP that uses an exposed paddle for excellent thermal impedance. It operates from -40°C to +85°C. A fully populated evaluation board is also available.

Features and Benefits
  • GaAs single ended 16.5 dB fixed gain amplifier
  • Internally matched input and output to 50 Ω
  • Fully specified gain and output power over temperature and supply
  • Small footprint package 3 mm × 2 mm LFCSP
  • Operation from 3 V to 5 V supply
  • Operation from dc to 1000 MHz
  • Fully specified for use at common IF frequencies 70, 190, 380 MHz
  • High third order intercept of +37 dBm
  • Output compression point of +22 dBm
  • Low noise figure 3 dB
  • RF & Microwave
    S-Parameters
    Design Tools
    Data Sheets
    Documentnote
    ADL5530: DC to 1000 MHz IF Gain Block Data Sheet (Rev. B)PDF 972.06 K
    Application Notes
    Documentnote
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0)PDF 804.11 K
    AN-1389: Recommended Rework Procedure for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0)PDF 133.7 K
    MMIC Amplifier Biasing Procedure Application NotePDF 435.1 K
    Broadband Biasing of Amplifiers General Application NotePDF 433.77 K
    Thermal Management for Surface Mount Components General Application NotePDF 189.99 K
    AN-669: Effectively Applying the AD628 Precision Gain Block (Rev. 0)PDF 193 kB
    AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0)PDF 439 kB
    Order Information
    Part NumberPackagePacking QtyTemp RangePrice 100-499Price 1000+RoHS
    ADL5530ACPZ-R7 Production8 ld LFCSP (2x3x.85mm)REEL 3000-40 to 85C01.35Y
    ADL5530ACPZ-WP Production8 ld LFCSP (2x3x.85mm)REEL 50-40 to 85C1.691.35Y
    Evaluation Boards
    Part NumberDescriptionPriceRoHS
    AD-FREQCVT1-EBZEvaluation Board349Y
    ADL5530-EVALZEvaluation Board100.19Y
    Reference Materials
    ADL5530: DC to 1000 MHz IF Gain Block Data Sheet (Rev. B) adl5530
    ADL5530 S-Parameters adl5530
    ADI RF Amplifier Library for Agilent ADS ad8353
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0) hmc8120
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0) hmc8120
    AN-1389: 引线框芯片级封装(LFCSP)的建议返修程序 (Rev. 0) ad9540
    AN-1389: Recommended Rework Procedure for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0) ad9856
    MMIC Amplifier Biasing Procedure Application Note hmc1049lp5e
    Broadband Biasing of Amplifiers General Application Note hmc1049lp5e
    Thermal Management for Surface Mount Components General Application Note hmc1049lp5e
    AN-669: Effectively Applying the AD628 Precision Gain Block (Rev. 0) ad8350
    AN-772: 引脚架构芯片级封装(LFCSP)设计与制造指南 (Rev. 0) ad9540
    AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) (Rev. 0) ad9856
    AN-669: 有效地使用AD628精密增益模块 (Rev. 0) ad8350
    RF Source Booklet adf9010