FDZ193P: -20V P-Channel 1.7V PowerTrench® WL-CSP MOSFET

Designed on Fairchild's advanced 1.7V PowerTrench® process with state of the art "low pitch" WLCSP packaging process, the FDZ193P minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).

Features

• Max r_DS(on) = 90mΩ at V_GS = -4.5V, I_D = -1A
• Max r_DS(on) = 130mΩ at V_GS = -2.5V, I_D = -1A
• Max r_DS(on) = 300mΩ at V_GS = -1.7V, I_D = -1A
• Occupies only 1.5 mm² of PCB area Less than 50% of the area of 2 x 2 BGA
• Ultra-thin package: less than 0.65 mm height when mounted to PCB
• RoHS Compliant

Application Notes