BLP7G07S-140P:功率LDMOS晶体管

140 W LDMOS功率晶体管,适合700 MHz至1000 MHz频率范围的基站应用。

特性和优势
    • 集成式ESD保护
    • 极佳的强度
    • 高效率
    • 极佳的热稳定性
    • 设计用于宽带操作(700 MHz至1000 MHz)
    • 内部匹配,便于使用
    • 符合欧盟2002/95/EC危害性物质限制(RoHS)指令
应用
    • 适用于W-CDMA基站的RF功率放大器
    • 700 MHz至1000 MHz频率范围内的多载波应用
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
frangefrequency range7001000MHz
PL(1dB)nominal output power at 1 dB gain compression140W
Gppower gainPL(AV) = 35 W; VDS = 28 V19.820.9dB
RLininput return lossPL(AV) = 35 W; VDS = 28 V; IDq = 1200 mA-14-7.5dB
ηDdrain efficiencyPL(AV) = 35 W; VDS = 28 V; 724 MHz < f < 821 MHz; IDq = 1200 mA26.929.6%
ACPR5Madjacent channel power ratio (5 MHz)PL(AV) = 35 W; VDS = 28 V; 724 MHz < f < 821 MHz; IDq = 1200 mA-36.3-32.4dBc
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLP7G07S-140P
HSOP4F
(SOT1223-1)
sot1223-1_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLP7G07S-140PY( 9340 669 72518 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1GATE1gate 1
2GATE2gate 2
3DRAIN2drain 2
4DRAIN1drain 1
5SOURCEsource
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLP7G07S-140PBLP7G07S-140PY33
文档资料
档案名称标题类型格式日期
BLP7G07S-140P (中文)Power LDMOS transistorData sheetpdf2013-03-29
AN10896Mounting and Soldering of RF transistorsApplication notepdf2015-03-24
AN11183Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
PCB_Design_BLP7G07S-140P_Data-sheetPCB Design BLP7G07S-140P (Data sheet)Design supportzip2013-03-19
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
NXP_RFpower_Lib_V09p0RF Power Model Library for Microwave Office®Simulation modelzip2014-11-11
NXP_RFpower_Manual_MWO_20141111RF Power Model Library Manual and Installation Instructions for Microwave Office®Simulation modelpdf2014-11-11
NXP_RFPower_Simulation_ExampleRF Power Simulation Example for Microwave Office®Simulation modelzip2012-06-11
BLP7G07S-140P_ADS-2009_ModelBLP7G07S-140P ADS-2009 ModelSimulation modelzip2013-08-02
sot1223-1_poplastic, heatsink small outline package; 4 leads(flat)Outline drawingpdf2012-05-03
订购信息
型号订购码 (12NC)可订购的器件编号
BLP7G07S-140P9340 669 72518BLP7G07S-140PY
模型
标题类型日期
RF Power Model Library for Microwave Office®Simulation model2014-11-11
RF Power Model Library Manual and Installation Instructions for Microwave Office®Simulation model2014-11-11
RF Power Simulation Example for Microwave Office®Simulation model2012-06-11
BLP7G07S-140P ADS-2009 ModelSimulation model2013-08-02
其它
标题类型日期
PCB Design BLP7G07S-140P (Data sheet)Design support2013-03-19
Power LDMOS transistor BLP7G07S-140P
Mounting and Soldering of RF transistors aerospace_defense
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
plastic, heatsink small outline package; 4 leads(flat) BLP8G20S-80P
RF Power Model Library for Microwave Office® CLF1G0060_S_30
RF Power Model Library Manual and Installation Instructions for Microwave Office® CLF1G0060_S_30
RF Power Simulation Example for Microwave Office® CLF1G0060_S_30
BLP7G07S-140P ADS-2009 Model BLP7G07S-140P
PCB Design BLP7G07S-140P (Data sheet) BLP7G07S-140P