Dual common cathode low-leakage diode encapsulated in a leadless ultra small DFN1006-3 (SOT883) Surface-Mounted Device (SMD) plastic package.
Name/Description | Modified Date |
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Dual common cathode low-leakage diode (REV 1.0) PDF (257.0 kB) BAV170M_1 [English] | 19 May 2016 |
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DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English] | 08 Feb 2016 |
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Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English] | 22 Jul 2016 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | VR max (V) | VR [max] (V) | IF max (mA) | IFSM [max] (A) | Configuration | VF [max] (mV) | IR [max] (nA) | trr max (ns) | VFmax (mV) | IFRM (mA) | IR max (nA) | trr [max] (ns) | IFSM max (A) | IF [max] (mA) | IFRM (mA) | Cd max. (pF) | Cd [max] (pF) |
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BAV170M | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 75 | 4 | dual c.c. | 1000@IF=10mA | 5@VR=75V | 1000 | 3000 | 320 | 2 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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BAV170M | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | BAV170MYL (9340 698 87315) | M7 | BAV170M | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |