BGA6289: MMIC wideband medium power amplifier
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband medium power amplifier with internal matching circuit.
SOT089
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| MMIC wideband medium power amplifier (REV 2.0) PDF (77.0 kB) BGA6289 | 15 Jun 2009 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 | 28 Nov 2012 |
SPICE model
- BGA6289 SPICE model (REV 1.3) prm BGA6289_1 6/8/2012
S-Parameters
- S-parameter BGA6289 (REV 1.0) ZIP SPAR_BGA6289 6/6/2012
Ordering Information
| Product | Status | Package version | Package name | frange [min] (MHz) | frange [max] (MHz) | @VCC (V) | ICC [typ] (mA) | ICC [max] (mA) | Gp (dB) | PL(1dB) (dBm) | IP3o (dBm) | NF (dB) | @f (MHz) | IP3O (dBm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGA6289 | End of Life | SOT89 | SOT89 | 100 | 3000 | 8 | 88 | 96 | 12 | 15 | 31 | 3.7 | 84 | 250 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGA6289 | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Discontinued | BGA6289,135 (9340 575 01135) | %3A |    | week 28, 2003 | 1 | 1 |
- Enabling the Mobile Experience rf
- NXP's RF Manual 18th edition OL2300NHN
- S-parameter BGA6289 BGA6289
- BGA6289 SPICE model BGA6289
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- SOT89 Reel pack, SMD, 7" T4 Turned 90 degree product orientation Ordering code (12NC) ending 147 BCX56-16
- Reel pack, SMD, 7" T3 Turned 270 degree product orientation Ordering code (12NC) ending 146 BCX53-16
- Footprint for reflow soldering SOT089 BFU590Q
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BFU590Q
- Footprint for wave soldering SOT089 BFU590Q
