EMIF02-1003M6：2-line EMI filter and ESD protection
The EMIF02-1003M6 is a 2 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.
This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on all pins.
Key Features
- Low capacitance
- Easy layout and flexibility due to single line topology
- High reduction of parasitic elements through integration and wafer level packaging.
- High reliability offered by monolithic integration
- Dual line EMI symmetrical (I/O) low-pass filter
- Very low PCB space consumption: 1.0 mm x 1.45 mm
- High efficiency in EMI filtering
- High efficiency in ESD suppression(IEC 61000-4-2 level 4).
- Lead free package
- Very thin package: 0.6 mm max
Product Specifications
| Description | Version | Size |
|---|---|---|
| DS5514: 2 line IPAD™, EMI filter and ESD protection in Micro QFN package | 1.2 | 195 KB |
Application Notes
| Description | Version | Size |
|---|---|---|
| AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use | 5.0 | 261 KB |
| AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use | 8.0 | 251 KB |
Technical Notes & Articles
| Description | Version | Size |
|---|---|---|
| TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches | 4.0 | 330 KB |
Sample & Buy
| Part Number | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
|---|---|---|---|---|---|---|---|
| EMIF02-1003M6 | uQFN-6L | Tape And Reel | 0.258 | 1000 | NEC | EAR99 | MALAYSIA |
Quality & Reliability
| Part Number | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| EMIF02-1003M6 | uQFN-6L | Industrial | Ecopack2 | md_pq-wspc-vfqfpn-wspc-1x1.45x0.55-wspc-6l_7cpqem2t13a.pdf md_pq-wspc-vfqfpn-wspc-1x1.45x0.55-wspc-6l_7cpqem2t13a.xml |
- circuit_diagram_13975_thumbnail.png EMIF02-1003M6
- IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
- IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
- Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
- md_pq-wspc-vfqfpn-wspc-1x1.45x0.55-wspc-6l_7cpqem2t13a.pdf EMIF02-1003M6
- md_pq-wspc-vfqfpn-wspc-1x1.45x0.55-wspc-6l_7cpqem2t13a.xml EMIF02-1003M6
