The EMIF04-EAR02M8 chip is a highly integrated device designed to suppress EMI/RFI noise for mobile phone headsets. The new LC architecture on the speaker lines provides a high attenuation value maintaining a very low serial resistance.
The μQFN-8L package offers the possibility to integrate the whole function in a very small PCB space.
Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.
Key Features
Description | Version | Size |
---|---|---|
DS6161: 4-line IPAD™ EMI filter and ESD protection for headset | 2.1 | 431 KB |
Description | Version | Size |
---|---|---|
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use | 5.0 | 261 KB |
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use | 8.0 | 251 KB |
Description | Version | Size |
---|---|---|
Enhanced ESD protection and EMI filters for audio/video interfaces | 1.0 | 823 KB |
The ultimate HDMI control-link buffer | 2.1 | 478 KB |
Part Number | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
---|---|---|---|---|---|---|---|
EMIF04-EAR02M8 | uQFN-8L | Tape And Reel | 0.501 | 1000 | NEC | EAR99 | MALAYSIA |
Part Number | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|
EMIF04-EAR02M8 | uQFN-8L | Industrial | Ecopack2 | md_tv-wspc-dfn.17.15.06-040-8l-e_ectvemi4t9a-wspc-(emif04-ear02m8)-wspc-wcp-wspc-ver2_signed.pdf md_tv-wspc-dfn.17.15.06-040-8l-e_ectvemi4t9a-wspc-(emif04-ear02m8)-wspc-wcp-wspc-ver2.xml |