EMIF06-HSD03F3：6-line EMI filter with integrated ESD protection for micro-SD Card™
The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.
The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV.
Key Features
- Very low line capacitance to compensate long PCB tracks (2.5 pF typ.)
- High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2)
- Very low PCB space consumption:
- Ultralow leakage current: 20 nA max.
- Very thin package: 0.605 mm
- Smart pinout for easier PCB layout
- High reduction of parasitic elements through integration and wafer level packaging
- Lead-free package
- Complies with the following standards:
- IEC 61000-4-2 level 4:±15 kV (air discharge), ±8 kV (contact discharge)
Product Specifications
Application Notes
Technical Notes & Articles
HW Model & CAD Libraries
Sample & Buy
| Part Number | Package | Packing Type | Unit Price (US$)
* | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
|---|
| EMIF06-HSD03F3 | Flip-Chip 400u | Tape And Reel | 0.207 | 1000 | NEC | EAR99 | CHINA |
Quality & Reliability
