BLC9G27LS-150AV：LDMOS功率晶体管
150 W LDMOS封装非对称Doherty功率晶体管，适用于2496 MHz至2690 MHz频率范围内的基站应用。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 2496 | 2690 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 150 | W | |||
| Gp | power gain | PL(AV) = 28 W; VDS = 28 V | 13.3 | 15 | dB | |
| RLin | input return loss | PL(AV) = 28 W; VDS = 28 V; IDq = 400 mA | -9 | -6 | dB | |
| ηD | drain efficiency | PL(AV) = 28 W; VDS = 28 V; 2496 MHz < f < 2690 MHz; IDq = 400 mA | 39 | 44 | % | |
| ACPR | adjacent channel power ratio | PL(AV) = 28 W; VDS = 28 V; 2496 MHz < f < 2690 MHz; IDq = 400 mA | -26 | -22 | dBc |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLC9G27LS-150AV |  DFM6 (SOT1275-1) | sot1275-1_po | Reel 13" Q1/T1 in Drypack | 量产 | Standard Marking | BLC9G27LS-150AVY( 9340 686 42518 ) | |
| Tray, NonBakeable, Multiple in Drypack | 量产 | Standard Marking | BLC9G27LS-150AVZ( 9340 686 42517 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | D1 | drain1 (main) |  |  |
| 2 | D2 | drain2 (peak) | ||
| 3 | G1 | gate1 (main) | ||
| 4 | G2 | gate2 (peak) | ||
| 5 | VDM | video decoupling (main) | ||
| 6 | VDP | video decoupling (peak) | ||
| 7 | S | source |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLC9G27LS-150AV | BLC9G27LS-150AVY |   | Always Pb-free | 3 | 3 |
| BLC9G27LS-150AV | BLC9G27LS-150AVZ | | Always Pb-free | 3 | 3 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLC9G27LS-150AV (中文) | Power LDMOS transistor | Data sheet | 2014-11-06 | |
| AN10896 | Mounting and Soldering of RF transistors | Application note | 2015-03-24 | |
| 75017347 | Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLC9G27LS-150AV_Data-sheet | PCB Design BLC9G27LS-150AV (Data sheet) | Design support | zip | 2014-11-06 |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| sot1275-1_po | plastic earless flanged cavity package; 6 leads | Outline drawing | 2013-04-23 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLC9G27LS-150AV | 9340 686 42518 | BLC9G27LS-150AVY |
| BLC9G27LS-150AV | 9340 686 42517 | BLC9G27LS-150AVZ |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLC9G27LS-150AV (Data sheet) | Design support | 2014-11-06 |
- Power LDMOS transistor BLC9G27LS-150AV
- Mounting and Soldering of RF transistors aerospace_defense
- Enabling the Mobile Experience rf
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- plastic earless flanged cavity package; 6 leads BLC9G27LS-150AV
- PCB Design BLC9G27LS-150AV (Data sheet) BLC9G27LS-150AV
